Abstract:Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by … Show more
“…Composites consist of two or more than two materials with different characteristics, and the materials are bonded via physical, chemical, physical-chemical, or mechanical mechanisms. In this study, two types of TPU are combined to form TPU composite films, thereby bettering the tensile performance of the composite films as well as strengthening the adhesion level among laminates [ 22 , 23 , 24 ]. The films can be adjusted according to the thickness and the resulting films exhibit a more even morphology than other films made by molds of various thicknesses via hot pressing.…”
Laminated composites have been commonly applied to all fields. When made into laminated composites, Kevlar woven fabrics are able to provide the required functions. In this study, two types of TPU are incorporated to improve the intralayer features of Kevlar/TPU laminated composites. Hence, the Kevlar/TPU laminated composites consist of firmly bonded laminates while retaining flexibility of the fabrics. Being the interlayer of the laminated composites, the TPU layer provides adhesion while strengthening the tensile property, dynamic puncture resistance, and buffer strength of Kevlar/TPU laminated composites. The test results indicate that with a blending ratio of two types of TRU being 85/15 wt%, the Kevlar/TPU laminated composites exhibit a tensile strength of 18.08 MPa. When the stacking thickness is 1 mm, the tensile strength is improved to 357.73 N with the buffering strength reaching 4224.40 N. Notably, with a thickness being 1.2 mm, the laminated composites demonstrate a dynamic resistance being 672.15 N. In the meanwhile, functional Kevlar fabrics are allowed to keep the fiber morphology owing to the protection of TPU composite films. Considering the composition of protective gear, Kevlar/TPU laminated composites possess a powerful potential and are worthwhile exploring.
“…Composites consist of two or more than two materials with different characteristics, and the materials are bonded via physical, chemical, physical-chemical, or mechanical mechanisms. In this study, two types of TPU are combined to form TPU composite films, thereby bettering the tensile performance of the composite films as well as strengthening the adhesion level among laminates [ 22 , 23 , 24 ]. The films can be adjusted according to the thickness and the resulting films exhibit a more even morphology than other films made by molds of various thicknesses via hot pressing.…”
Laminated composites have been commonly applied to all fields. When made into laminated composites, Kevlar woven fabrics are able to provide the required functions. In this study, two types of TPU are incorporated to improve the intralayer features of Kevlar/TPU laminated composites. Hence, the Kevlar/TPU laminated composites consist of firmly bonded laminates while retaining flexibility of the fabrics. Being the interlayer of the laminated composites, the TPU layer provides adhesion while strengthening the tensile property, dynamic puncture resistance, and buffer strength of Kevlar/TPU laminated composites. The test results indicate that with a blending ratio of two types of TRU being 85/15 wt%, the Kevlar/TPU laminated composites exhibit a tensile strength of 18.08 MPa. When the stacking thickness is 1 mm, the tensile strength is improved to 357.73 N with the buffering strength reaching 4224.40 N. Notably, with a thickness being 1.2 mm, the laminated composites demonstrate a dynamic resistance being 672.15 N. In the meanwhile, functional Kevlar fabrics are allowed to keep the fiber morphology owing to the protection of TPU composite films. Considering the composition of protective gear, Kevlar/TPU laminated composites possess a powerful potential and are worthwhile exploring.
“…The diffraction peaks (002), (100), (101), (102), (004), and (112) shown in Figure 2 b were the XRD characteristic diffraction peaks of h-BN and BNG. The XRD characteristic peaks of LMPA were Sn (29.8°, 32.1°), Bi (36.3°, 47.4°), and In (58.7°, 66.4°) [ 24 ]. The presence of Ga in LMPA was not directly detected by XRD, thus indicating that the Ga signal was too weak or Ga was absent in LMPA.…”
Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power components and heat sinks, can effectively reduce heat accumulation in electronic components. To reduce the interface thermal resistance of thermally conductive gel, hexagonal boron nitride and graphene oxide were hybridized with a low-melting-point alloy in the presence of a surface modifier, humic acid, to obtain a hybrid filler. The results showed that at the nanoscale, the low-melting-point alloy was homogeneously composited and encapsulated in hexagonal boron nitride and graphene oxide, which reduced its melting range. When the temperature reached the melting point of the low-melting-point alloy, the hybrid powder exhibited surface wettability. The thermal conductivity of the thermally conductive gel prepared with the hybrid filler increased to 2.18 W/(m·K), while the corresponding thermal contact resistance could be as low as 0.024 °C/W. Furthermore, the thermal interface material maintained its excellent electric insulation performance, which is necessary for electronic device applications.
The lifespan and the performance of flexible electronic devices and components are affected by the large accumulation of heat, and this problem must be addressed by thermally conductive polymer composite films. Therefore, the need for the development of high thermal conductivity nanocomposites has a strong role in various applications. In this article, the effect of different particle reinforcements such as single and hybrid form, coated and uncoated particles, and chemically treated particles on the thermal conductivity of various polymers are reviewed and the mechanism behind the improvement of the required properties are discussed. Furthermore, the role of manufacturing processes such as injection molding, compression molding, and 3D printing techniques in the production of high thermal conductivity polymer composites is detailed. Finally, the potential for future research is discussed, which can help researchers to work on the thermal properties enhancement for polymeric materials.
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