2015
DOI: 10.1109/tcpmt.2015.2426720
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Fabrication of Microstructures in LTCC Technology Using Selective Laser Ablation

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Cited by 5 publications
(4 citation statements)
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“…The possibility of integrating electronic wirings, magnetic or piezoelectric components, and thick-film passive elements in 3D mechanical structures complements the benefit array of this technology. Therefore, LTCC is widely used in environmental resisted, multilayer, high frequency circuits, sensors, actuators, micro-systems, etc [8,[31][32][33]. Since micro-fluidic channel and chamber systems together with actuators, sensors, and electronic circuits can be bound in a common multilayer structure, the great opportunity to create sophisticated platforms for micro-reactors appears.…”
Section: Low Power Ltcc Flow Sensormentioning
confidence: 99%
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“…The possibility of integrating electronic wirings, magnetic or piezoelectric components, and thick-film passive elements in 3D mechanical structures complements the benefit array of this technology. Therefore, LTCC is widely used in environmental resisted, multilayer, high frequency circuits, sensors, actuators, micro-systems, etc [8,[31][32][33]. Since micro-fluidic channel and chamber systems together with actuators, sensors, and electronic circuits can be bound in a common multilayer structure, the great opportunity to create sophisticated platforms for micro-reactors appears.…”
Section: Low Power Ltcc Flow Sensormentioning
confidence: 99%
“…Further improvement can consist in applying the laser technique to form different shapes in multilayer structures (especially in the chamber part). The most sophisticated seems to be the laser ablation in which an infrared beam is used to precisely ablate surface of an unfired LTCC stack of green tapes [33]. The depth of ablation depends on applied process parameters like power, head speed, pulse repetition rate, etc.…”
Section: Low Power Ltcc Flow Sensormentioning
confidence: 99%
“…These include photo‐imageable pastes, etching of thick film paste on LTCC and laser structuring. These techniques enabled structure resolutions in sub‐10 μm range, which is well below the standard screen printing resolution 8–11 …”
Section: Introductionmentioning
confidence: 97%
“…These techniques enabled structure resolutions in sub-10 µm range, which is well below the standard screen printing resolution. [8][9][10][11] This paper describes a technique of transfer technology for realizing high-resolution microstructures on LTCC. Previously, US patents have described methods for producing high-density, fine circuit pattern printed circuit boards using such transfer technology.…”
Section: Introductionmentioning
confidence: 99%