Design, simulation and fabrication of LTCC-based microhotplate for gas sensor applications

Kulhari, Lokesh; Khanna, P. K.

doi:10.1007/s00542-018-3731-7

Cited by 10 publications

(8 citation statements)

References 20 publications

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“…The temperature–voltage behavior of both simulation and experimental results are same, but the value of peak temperature of fabricated heaters is little less owing to the heat losses which are not considered in simulation. The convection losses are area-dependent and radiation losses are considered negligible up to 400°C (Kulhari and Khanna, 2018).…”

Section: Resultsmentioning

confidence: 99%

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Design, fabrication and characterization of LTCC micro-hotplates for gas-sensing application

Kulhari

Chandran

Ray

et al. 2019

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Purpose Low temperature co-fired ceramics (LTCC) technology-based micro-hotplates are of immense interest owing to their ruggedness, high temperature stability and reliability. The purpose of this paper is to study the role of thermal mass of LTCC-based micro-hotplates on the power consumption and temperature for gas-sensing applications. Design/methodology/approach The LTCC micro-hotplates with different thicknesses are designed and fabricated. The role of thermal mass on power consumption and temperature of these hotplates are simulated and experimentally studied. Also, a comparison study on the performance of LTCC and alumina-based hotplates of equivalent thickness is done. A thick film-sensing layer of tin oxide is coated on LTCC micro-hotplate and demonstrated for the sensing of commercial liquefied petroleum gas. Findings It is found from both simulation and experimental studies that the power consumption of LTCC hotplates was decreasing with the decrease in thermal mass to attain the same temperature. Also, the LTCC hotplates are less power-consuming than alumina-based one, owing to their superior thermal characteristics (low thermal conductivity, 3.3 W/ [m-K]). Originality/value This study will be beneficial for designing hotplates based on LTCC technology with low power consumption and better stability for gas-sensing applications.

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Section: Resultsmentioning

confidence: 99%

“…The electro-thermal simulation study of micro-heaters is performed using the Joule-heating module of COMSOL Multiphysics software. The material parameters used in the simulation study are given in Table I (Kulhari and Khanna, 2018).…”

Section: Design and Simulationmentioning

confidence: 99%

Design, fabrication and characterization of LTCC micro-hotplates for gas-sensing application

Kulhari

Chandran

Ray

et al. 2019

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“…In recent years, the potential of LTCC hotplates for developing metal oxide (MOx)-based gas sensors has been demonstrated (Kita et al, 2000;Rettig and Moos, 2004;Kita et al, 2005;Urbančík et al, 2007;Jain and Khanna, 2007;Kharbanda and Khanna, 2012;Kulhari and Khanna, 2018;Kharbanda et al, 2018). Since the activation temperature required by the sensing film to detect a particular gas is provided by the hotplate beneath, therefore, the hotplate is often referred as the heart of the MOx-based gas sensor.…”

Section: Introductionmentioning

confidence: 99%

“…In this paper efforts have been made, using electro-thermal finite element method (FEM) analysis in COMSOL Multiphysics software, to observe the effect of critical parameters, namely, thermal mass, aspect ratio and print-line thickness, which have a significant impact on the power of LTCC-based hotplates. The designed hotplate structure is fabricated by using LTCC process steps (Kulhari and Khanna, 2018;Kharbanda et al, 2018). Material parameters used during the simulation are listed in Table I.…”

Section: Introductionmentioning

confidence: 99%

Electro-thermal simulation and fabrication of LTCC hotplate with lead-free interconnects

Kharbanda

Suri

Khanna

2019

SSMT

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Purpose The purpose of this paper is to explore a new possibility of providing high-temperature stable lead-free interconnections for low-temperature co-fired ceramics (LTCC) hotplate. For gas-sensing application, a temperature range of 200°C-400°C is usually required by the sensing film to detect different gases which imply the requirement of thermally stable interconnects. To observe the effect of parameters influencing power of the device, electro-thermal simulation of LTCC hotplate is also presented. Simulated LTCC hotplate is fabricated using the LTCC technology. Design/methodology/approach The proposed task is to fabricate LTCC hotplate with interconnects through vertical access. Dedicated via-holes generated on the LTCC hotplate are used to provide the interconnections. These interconnections are based on adherence and bonding mechanism between LTCC and thick film. COMSOL software is used for finite element method (FEM) simulation of the LTCC hotplate structure. Findings Thermal reliability of these interconnections is tested by continuous operation of hotplate at 350°C for 175 h and cycling durability test performed at 500°C. Additionally, vibration test is also carried out for the hotplate with no damage observed in the interconnections. An optimized firing profile to reproduce these interconnections along with the experimental flowchart is presented. Research limitations/implications Research activity includes design and fabrication of LTCC hotplate with metal to thick-film based interconnections through vertical access. Research work on interconnections based on adherence of LTCC and thick film is limited. Practical implications A new way of providing lead-free and reliable interconnections will be useful for gas sensor fabricated on LTCC substrate. The FEM results are useful for optimizing the design for developing low-power LTCC hotplate. Originality/value Adherence and bonding mechanism between LTCC and thick film can be used to provide interconnections for LTCC devices. Methodology for providing such interconnections is discussed.

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“…Typically, LTCC microheaters have heater pattern printed either on top layer or buried in the inner layer of LTCC structure. [14][15][16][17] To attain a same peak temperature over the active area buried heaters consumes lower power as compared to surface heaters, however devices with surface heaters possess more uniform thermal distribution at peak temperature area. 18 LTCC is a multilayer technology in which two or more screen printed tape layers can be connected through conductive vias.…”

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confidence: 99%

Design, Fabrication and Characterization of Inter-Layer Microheaters Using LTCC Technology

Kharbanda

Suri

Khanna

2022

ECS J. Solid State Sci. Technol.

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This paper presents design, fabrication and characterization of novel inter-layer microheaters based on low temperature co-fired ceramics (LTCC) technology. LTCC microheater structures (S1 to S3) with three different heater configurations has been presented. Microheater structure S1 has a heater pattern generated only on the top LTCC layer while S2 and S3 structures have inter-layer heater patterns. These structures have been simulated using COMSOL software to depict the temperature distribution over the active area. LTCC being a multilayer technology, heater patterns are generated in two different layers of LTCC tapes and connected through vias (3D interconnections) to fabricate inter-layer microheaters. By distributing the heater pattern of S1 equally in two LTCC tape layers (as in S3), this method allows possibility to develop miniature LTCC microheaters using conventional screen-printing process. The developed microheaters are characterized and the results are compared. At an input power of ~ 1W, structure S3 reaches a peak temperature of 316 °C as compared to 272 °C achieved with S1 configuration. Thermal imaging results shows better temperature uniformity in the active area for inter-layer microheaters as compared to microheater having heater pattern only on the top LTCC layer.

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Design, simulation and fabrication of LTCC-based microhotplate for gas sensor applications

Cited by 10 publications

References 20 publications

Design, fabrication and characterization of LTCC micro-hotplates for gas-sensing application

Design, fabrication and characterization of LTCC micro-hotplates for gas-sensing application

Electro-thermal simulation and fabrication of LTCC hotplate with lead-free interconnects

Design, Fabrication and Characterization of Inter-Layer Microheaters Using LTCC Technology

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