Fabrication of mechanical structures in p-type silicon using electrochemical etching

Ohji, Hiroshi; French, P.J.; Tsutsumi, Kazuhiko

doi:10.1016/s0924-4247(99)00341-6

Cited by 35 publications

(16 citation statements)

References 9 publications

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“…The macro-porous process usually requires low n-doped material and illumination from the backside, which may not be compatible with the IC process. However, some macro-porous etching has been achieved in p-type material (Ohji, 2000), although the process is more difficult to control. Deep reactive ion etching (DRIE), addressed some of the limitations of wet etching, although the process is more expensive.…”

Section: Bulk Micromachiningmentioning

confidence: 99%

Integrated MEMS: Opportunities & Challenges

French¹,

Sarro²

2012

Micromachining Techniques for Fabrication of Micro and Nano Structures

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Section: Bulk Micromachiningmentioning

confidence: 99%

Integrated MEMS: Opportunities & Challenges

French¹,

Sarro²

2012

Micromachining Techniques for Fabrication of Micro and Nano Structures

Self Cite

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“…The deposition of metallic thin layers/particles is one of the key processes for producing feasible electrochemical devices; it should adhere strongly to the membrane in order to reduce ohmic losses and to support high mechanical stresses produced during the operation [17]. Since our aim was to compare the PS as substrate for both metallic thin film or metallic particle distribution on Si fibrils, both physical and chemical procedures have used: (i) platinum (Pt) thin film has been deposited on PS using Ebeam high vacuum thin film deposition system (NEVA EDV-500A), and respectively (ii) a metallic precursor solution was used to achieve the chemical attachment of particles on nanostructurated Si based supports by simple immersion of the samples for different periods of time, from one hour to five days [18].…”

Section: Metallic Nanoparticle Depositionmentioning

confidence: 99%

Electrocatalytic Activity of Platinum Nanoparticles Supported on Nanosilicon

et al. 2010

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Platinum (Pt) nanocatalysts were deposited on/inside of nanostructured silicon (nanoSi) matrix using physico‐chemical methods, i.e. E‐beam high vacuum Pt thin film and, respectively, chemically loaded Pt nanoparticles from hexachloroplatinic acid aqueous or alcoholic precursor solutions. High resolution morphological characterisations, completed by microstructural and compositional analyses have been performed to characterise the nanoSi catalyst support and to investigate the Pt thin film nanostructuration as well as the nanoparticle attachment and clustering processes, evidencing the controlling factors and conditions of the size, morphology and distribution. Furthermore, the experimental structures have been subjected to different electrochemical tests and it was revealed that significant improvement of the long term catalyst stability was achieved when the metal‐porous Si nanoassemblies is formed, which represents a step closer to the realisation of the monolithic integrated Si‐based microfabricated fuel cell.

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“…This process is usually limited to n-type material, but there have been examples of macro-porous silicon in p-type material using an alternative etchannt. [19] Deep reactive ion etching (DRIE), addressed some of the limitations of wet etching, although the process is more expensive. Two main processes are cryogenic [20] and Bosch processes [21].…”

Section: A Bulk Micromachiningmentioning

confidence: 99%

To integrate or not to integrate

French

Sarro

2010

2010 IEEE Sensors

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For almost 50 years, silicon sensors and actuators have been on the market. Early devices were simple sand-alone sensors and some had wide commercial success. There have been many examples of success stories for simple silicon sensors, such as the Hall plate and photo-diode. The development of micromachining techniques brought pressure sensors and accelerometers into the market and later the gyroscope. To achieve the mass market the devices had to be cheap and reliable. Integration can potentially reduce the cost of the system so long as the process yield is high enough and the devices can be packaged. The main approaches are; full integration (system-ona-chip), hybrid (system-in-a-package) or in some cases separate sensors with remote electronics. The last can be the case when the environment is unsuitable for the electronics. The critical issues are reliability and packaging if these devices are to find the applications. This paper examines the development of the technologies, some of the success stories and the opportunities for integrated Microsystems as well as the potential problems and applications where integration is not the best option.

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Fabrication of mechanical structures in p-type silicon using electrochemical etching

Cited by 35 publications

References 9 publications

Integrated MEMS: Opportunities & Challenges

Integrated MEMS: Opportunities & Challenges

Electrocatalytic Activity of Platinum Nanoparticles Supported on Nanosilicon

To integrate or not to integrate

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