Fabrication of magnetic microstructures by using thick layer resists

Löchel, Bernd; Maciossek, A.; König, M.; Huber, H.-L.; Bauer, G.

doi:10.1016/0167-9317(93)90111-h

Cited by 13 publications

(3 citation statements)

References 2 publications

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“…Alternative processes for patterning a thick resist layer are being investigated which eliminate the XRL processing step, such as optical lithography in a bilayer scheme [2,3] or direct writing by a high energy electron beam pattern generator [2]. In recent years, thick resist technology has continuously improved as a result of the needs of the micromachining community [39][40][41]. Near UV contact photolithography can be used to create a resist stencil with an aspect ratio of 10 with low to medium resolution (> 5 µm).…”

Section: Lithographic Optionsmentioning

confidence: 99%

Masks for high aspect ratio x-ray lithography

Malek

Jackson

Bonivert

et al. 1996

J. Micromech. Microeng.

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The requirements for deep x-ray lithography (DXRL) masks are reviewed and a recently developed cost effective mask fabrication process is described. The review includes a summary of tabulated properties for materials used in the fabrication of DXRL masks. X-ray transparency and mask contrast are calculated for material combinations using simulations of exposure at the Advanced Light Source (ALS) at Berkeley, and compared to the requirements for standard x-ray lithography (XRL) mask technology. Guided by the requirements, a cost-effective fabrication process for manufacturing high contrast masks for DXRL has been developed. Thick absorber patterns () on a thin silicon wafer (m) were made using contact printing in thick positive (Hoechst 4620) and negative (OCG 7020) photoresist and subsequent gold electrodeposition. Gold was deposited using a commercially available gold sulphite bath with low current density and good agitation. The resultant gold films were fine-grained and stress-free. Replication of such masks into thick acrylic sheets was performed at the ALS.

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Section: Lithographic Optionsmentioning

confidence: 99%

Masks for high aspect ratio x-ray lithography

Malek

Jackson

Bonivert

et al. 1996

J. Micromech. Microeng.

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“…The extensive knowledge of interfacial dynamics and structure would direct the a priori solution to the problems existing in the process of electrodeposition . Electrodeposition plays a vital role in applications like thin films, − microelectronics, − microelectromechanical systems, and nanofabrication. − Electrodeposition of metals has several aspects that complement the aforementioned fields such as (i) control of deposition thickness precisely to nanometer scale, (ii) the reversibility of the phenomena for most of the metals, and (iii) attaining complex structures like two-dimensional 8 (2-D) and three-dimensional 8 (3-D) topographies that are difficult to achieve via conventional fabrication techniques. Recent works on electrodeposition primarily focus on copper (Cu) deposition 14 which involves length scales of a micrometer or even less.…”

Section: Introductionmentioning

confidence: 99%

Monte Carlo Simulation of Electrodeposition of Copper: A Multistep Free Energy Calculation

Harinipriya

Subramanian

2008

J. Phys. Chem. B

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Electrodeposition of copper (Cu) involves length scales of a micrometer or even less. Several theoretical techniques such as continuum Monte Carlo, kinetic Monte Carlo (KMC), and molecular dynamics have been used for simulating this problem. However the multiphenomena characteristics of the problem pose a challenge for an efficient simulation algorithm. Traditional KMC methods are slow, especially when modeling surface diffusion with large number of particles and frequent particle jumps. Parameter estimation involving thousands of KMC runs is very time-consuming. Thus a less time-consuming and novel multistep continuum Monte Carlo simulation is carried out to evaluate the step wise free energy change in the process of electrochemical copper deposition. The procedure involves separate Monte Carlo codes employing different random number criterion (using hydrated radii, bare radii, hydration number of the species, redox potentials, etc.) to obtain the number of species (CuCl(2) or CuSO(4) or Cu as the case may be) and in turn the free energy. The effect of concentration of electrolyte, influence of electric field and presence of chloride ions on the free energy change for the processes is studied. The rate determining step for the process of electrodeposition of copper from CuCl(2) and CuSO(4) is also determined.

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“…[1][2][3][4][5][6][7][8] Patterning of resist layers up to 200 m using ultraviolet ͑UV͒ light and contact printing was reported. For many years the development has focused on high resolution and high printing accuracy.…”

Section: Introductionmentioning

confidence: 99%

Application of ultraviolet depth lithography for surface micromachining

Loechel

Maciossek

Rothe

1995

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Very thick photoresist layers were patterned by contact ultraviolet ͑UV͒ lithography. In a following microelectrodeposition step the generated resist patterns were molded and three-dimensional ͑3D͒ microstructures were fabricated directly onto system surfaces. The new technology, called 3D UV-microforming, consists of an advanced resist preparation process, an UV lithographic step, resist development, a molding procedure by electrodeposition, and finally stripping and cleaning for finishing the structures. It enables the low-cost fabrication of a wide variety of microcomponents for many different uses. During resist preparation, layers up to 200 m thickness were obtained. By using a standard UV mask aligner as an exposure tool followed by immersion development, thick resist layers up to 100 m could be patterned in a single step on preprocessed silicon wafers. Repeated exposure and development were successfully used for structuring resist layers of up to 200 m thickness. Using AZ 4000 series photoresist, the resolution is also limited by mechanical stability. For lines and spaces in 15-m-thick resist a minimum width of 3 m for the resist was found to be necessary to overcome the fabrication process. For thicker layers high aspect ratios of more than 10 as well as steep edges of more than 88°could be fabricated. The resist patterns used were molded by pulse or by direct current electroplating. For microsystem applications some metals and alloys were deposited. Three-dimensional microcomponents were fabricated as samples for demonstrating the new technique. The technique allows the use of materials with interesting properties, ones that could not be provided by standard processes.

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Fabrication of magnetic microstructures by using thick layer resists

Cited by 13 publications

References 2 publications

Masks for high aspect ratio x-ray lithography

Masks for high aspect ratio x-ray lithography

Monte Carlo Simulation of Electrodeposition of Copper: A Multistep Free Energy Calculation

Application of ultraviolet depth lithography for surface micromachining

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