Fabrication of half-pitch 32nm resist patterns using near-field lithography with a-Si mask

Ito, Tsugutaka; Yamada, Tomohiro; Inao, Yasuhisa; Yamaguchi, Takako; Mizutani, Natsuhiko; Kuroda, Ryo

doi:10.1063/1.2227633

Cited by 35 publications

(23 citation statements)

References 6 publications

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“…However, phenomena at a structured liquid-solid interface, such as evaporation, condensation, diffusion, and wetting, are related to complex physics and chemistry over a wide range of temporal-spatial scale, and hence, it is difficult to obtain a complete picture of the phenomena. 1,2 In the semiconductor industry, with the help of the photolithographic technique which enables us to produce nanometerscale structures, 3 controlling those phenomena in the vicinity of the structures is a crucial issue especially in the wet cleaning process used to manufacture semiconductor devices, 4 and a precise understanding of those phenomena is also beneficial to design surfaces to control the mass, momentum, and energy transport phenomena which occur at and through the interface. a) Electronic mail: ku.fujiwara@screen.co.jp b) Electronic mail: siba@mech.eng.osaka-u.ac.jp…”

Section: Introductionmentioning

confidence: 99%

Local pressure components and interfacial tensions of a liquid film in the vicinity of a solid surface with a nanometer-scale slit pore obtained by the perturbative method

Fujiwara

Shibahara

2015

The Journal of Chemical Physics

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A classical molecular dynamics simulation was conducted for a liquid-solid interfacial system with a nanometer-scale slit pore in order to reveal local thermodynamic states: local pressure components and interfacial tensions of a liquid film in the vicinity of the slit. The simulation also examined the transition mechanism between the two states of the liquid film: (a) liquid film on the slit and (b) liquid film in the slit, based on the local thermodynamic quantities from a molecular point of view. An instantaneous expression of the local pressure components and interfacial tensions, which is based on a volume perturbation, was presented to investigate time-dependent phenomena in molecular dynamics simulations. The interactions between the particles were described by the 12-6 Lennard-Jones potential, and effects of the fluid-solid interaction intensity on the local pressure components and interfacial tensions of the fluid in the vicinity of the slit were examined in detail by the presented perturbative method. The results revealed that the local pressure components tangential to the solid surface in the vicinity of the 1st fluid layer from the solid surface are different in a two dimensional plane, and the difference became pronounced in the vicinity of the corner of the slit, for cases where the fluid-solid interaction intensities are relatively strong. The results for the local interfacial tensions of the fluid inside the slit suggested that the local interfacial tensions in the vicinity of the 2nd and 3rd layers of the solid atoms from the entrance of the slit act as a trigger for the transition between the two states under the influence of a varying fluid-solid interaction.

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Section: Introductionmentioning

confidence: 99%

Local pressure components and interfacial tensions of a liquid film in the vicinity of a solid surface with a nanometer-scale slit pore obtained by the perturbative method

Fujiwara

Shibahara

2015

The Journal of Chemical Physics

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“…Recently, many sorts of near-field lithography systems have been reported [18][19][20][21][22]. Conventional near-field lithography has achieved sub-50 nm resolution using special masks such as lightcoupling mask or phase-shift mask [23].…”

Section: Introductionmentioning

confidence: 99%

Plasmonic Nanolithography: A Review

Xie

Wang

et al. 2011

Plasmonics

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Surface plasmon polaritons (SPPs) has attracted great attention in the last decade and recently it has been successfully applied to nanolithography due to its ability of beyond diffraction limit. This article reviews the recent development in plasmonic nanolithography, which is considered as one of the most remarkable technology for next-generation nanolithography. Nanolithography experiments were highlighted on the basis of SPPs effect. Three types of plasmonic nanolithography methods: contact nanolithography, planar lens imaging nanolithography, and direct writing nanolithography were reviewed in detail, and their advantages and shortages are analyzed and compared, respectively. Finally, the development trend of plasmonic nanolithography is suggested.

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“…As such, a template manufacturing process that is capable of easily fabricating 3D templates while also enabling the bottomup filling of the 3D template could be used in applications such as chiral photonics, 3-5 MEMS, 11 chemistry-on-a-chip, 12 nanofluidics, 13 and more. [14][15][16][17] To overcome these challenges, this article introduces a simple twostep process to both create a 3D template and fill it using wet chemical techniques. First, a 3D template is fabricated in silicon using Metalassisted Chemical Etching (MaCE) and then the MaCE catalyst rez E-mail: cp.wong@mse.gatech.edu maining at the bottom of the template is used as a seed to electrolessly fill the 3D template from the bottom-up.…”

mentioning

confidence: 99%

Combining Electroless Filling with Metal-Assisted Chemical Etching to Fabricate 3D Metallic Structures with Nanoscale Resolutions

Hildreth

Honrao

Sundaram

et al. 2013

ECS Solid State Letters

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This work introduces a simple process to fabricate 3D metallic structures with micro to nano-sized features. Star-shaped gold catalysts were fabricated using electron beam lithography and used as catalysts in MaCE to form spiraling 3D structures. High fidelity was verified by adding 30 nm wide holes in some catalysts for form 30 nm wide spiraling silicon pillars. The gold catalyst remaining at the bottom of the 3D MaCE template was used as a seed for electroless deposition of Pd and the resulting structure extracted using tetramethylammonium hydroxide to form a freestanding 3D metallic structure with nano-sized 3D spiraling holes.Many useful devices are created by the act of forming a small hole and filling it with metal. For example, thru-silicon-vias used in 3D electronic packaging are fabricated by etching a hole in silicon and filling it with copper to serve as an electrical interconnect, 1,2 while optical waveguides often consist of small channels filled with silver or gold. [3][4][5] Large volume manufacturing has shown that planar 2D nanostructures, such as microelectromechanical systems (MEMS) and transistors, can be fabricated using a mix of photolithography, etching, and electroless filling techniques; however, 3D templates are typically difficult to fabricate and fill on this small scale. The problem can readily be attributed to the fact that, like many processes, both fabricating and filling templates becomes increasingly difficult as feature sizes approach the sub-micron to nano-sized domains. As a result, trade-offs between structure complexity and manufacturability are often made.The root cause of this limitation can be traced to the constraints of current nanofabrication frameworks that are heavily dependent on wet chemical and dry etching processes centered around stationary masks used in combination with lithography and thin-film deposition/growth processes. While this combination is widely used to form cantilevers, MEMS, photonic devices, and more, 6 these shapes are generally limited to simple undercuts or buildups of 2D patterns and require multiple lithography, etching, and deposition cycles to create a 2.5D structure consisting predominately of planar, 2D objects stacked horizontally on top of each other. 7 Overall, this process can be extremely time consuming, has limited feature fidelity, and is expensive. 8,9 The problem of 3D fabrication is further exacerbated by the difficulties of filling templates that have complex 3D geometry and/or high aspect ratios, as evaporation and sputter processes are not well suited for filling these structures. 10 Luckily, electrochemical and electroless deposition techniques can be used to fill sub-micron templates with high feature fidelity in cases where either a metal ground plane or seed layer is available at the bottom of the template. As long as these features are present, the structures fabricated using electrochemical and electroless deposition are typically limited to the capabilities of the process used to define the template itself. As such, a ...

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Fabrication of half-pitch 32nm resist patterns using near-field lithography with a-Si mask

Cited by 35 publications

References 6 publications

Local pressure components and interfacial tensions of a liquid film in the vicinity of a solid surface with a nanometer-scale slit pore obtained by the perturbative method

Local pressure components and interfacial tensions of a liquid film in the vicinity of a solid surface with a nanometer-scale slit pore obtained by the perturbative method

Plasmonic Nanolithography: A Review

Combining Electroless Filling with Metal-Assisted Chemical Etching to Fabricate 3D Metallic Structures with Nanoscale Resolutions

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