Fabrication of Electrically Conductive Patterns on Acrylonitrile-Butadiene-Styrene Polymer Using Low-Pressure Cold Spray and Electroless Plating

Akin, Semih; Tsai, Jung-Ting; Park, Min Soo; Jeong, Young Hun; Jun, Martin Byung‐Guk

doi:10.1115/1.4049578

Cited by 3 publications

(5 citation statements)

References 28 publications

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“…In the present study, the feedstock Tin (Sn) particles with a size range of 10-45 µm [20] were cold deposited on the 3D printed PLA surface through a CS system (Rus Sonic Inc., Model K205/407R, Russia), in which the deposition nozzle was mounted on a programmable robot arm (Kuka KR Agilus). The CS experimental setup is shown in Figure 2a, and further details regarding the experimental setup can be found in the authors' previous works [21][22][23]. Air was used as the compressed propellant gas at a gauge pressure of 0.7 MPa.…”

Section: Methodsmentioning

confidence: 99%

Fully Additively Manufactured Counter Electrodes for Dye-Sensitized Solar Cells

Akin,

Kim,

Song

et al. 2024

Micromachines

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In dye-sensitized solar cells (DSSCs), the counter electrode (CE) plays a crucial role as an electron transfer agent and regenerator of the redox couple. Unlike conventional CEs that are generally made of glass-based substrates (e.g., FTO/glass), polymer substrates appear to be emerging candidates, owing to their intrinsic properties of lightweight, high durability, and low cost. Despite great promise, current manufacturing methods of CEs on polymeric substrates suffer from serious limitations, including low conductivity, scalability, process complexity, and the need for dedicated vacuum equipment. In the present study, we employ and evaluate a fully additive manufacturing route that can enable the fabrication of CEs for DSSCs in a high-throughput and eco-friendly manner with improved performance. The proposed approach sequentially comprises: (1) material extrusion 3-D printing of polymer substrate; (2) conductive surface metallization through cold spray particle deposition; and (3) over-coating of a thin-layer catalyzer with a graphite pencil. The fabricated electrodes are characterized in terms of microstructure, electrical conductivity, and photo-conversion efficiency. Owing to its promising electrical conductivity (8.5 × 104 S·m−1) and micro-rough surface structure (Ra ≈ 6.32 µm), the DSSCs with the additively manufactured CEs led to ≈2.5-times-higher photo-conversion efficiency than that of traditional CEs made of FTO/glass. The results of the study suggest that the proposed additive manufacturing approach can advance the field of DSSCs by addressing the limitations of conventional CE manufacturing platforms.

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Section: Methodsmentioning

confidence: 99%

Fully Additively Manufactured Counter Electrodes for Dye-Sensitized Solar Cells

Akin,

Kim,

Song

et al. 2024

Micromachines

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“…According to Akin et al, CrO 3 was used as a strong oxidizing agent to form the Cu layer. However, copper was removed by adhesive tape and peeled off along the square grid as a result of the tape adhesion test [17]. An additional result from Jung et al confirmed the importance of the etching solution, highlighting that it affected adhesion strength due to weak oxidizing power [18].…”

Section: Adhesion Strength Between Pekk-ni Coatingmentioning

confidence: 99%

Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs

et al. 2022

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PEKK (polyether-ketone-ketone) polymer has been actively studied in applying electronic devices in satellites owing to its excellent light weight and thermal resistance. However, the limitation of metal coating to form on the PEKK surface is due to the high-volume resistivity and surface resistance. Here, we have investigated the correlations between the chemical treatment of the surface and adhesion strength between polymer–metal coating. Three-dimensional printed PEKK objects were manufactured and nickel was deposited on the surface by electroless plating. As the concentration of H2SO4 increased from 12.5 to 14.3 mol/L, the pore diameter showed a tendency to increase. However, as growing pore induced connecting each other, the pore size re-decreased from 15.1 to 18.0 mol/L. To control pore size and uniformity, we investigated the pore diameter of 3D printed PEKK as a function of treatment time and temperature. Uniform pores were observed at a temperature of 50 °C which were formed after 10 min and the average pore size was 0.28. After H2SO4 swelling, samples were re-treated in the KMnO4-H3PO4 etching system for the hydrophilic group. KMnO4 broken C=C bonding and generated hydrophilic groups such as -COOH and -OH, the contact angle decreased from 64.7 to 51.1° compared with H2SO4 swelling. XPS survey spectra confirmed that not only breaking C=C bonding but also increasing hydrophilicity due to -OH, -C-, -SO3 and the catalyst absorption of Pd was improved. As a result of adhesive strength by ASTM D3359, compared with the H2SO4 swelling, the KMnO4-H3PO4 etching system showed 5B which is the best result in standard test methods by adhesive tape test and peeling amount on the tape was less than 0.01%.

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“…27,28 In this regard, the as-CS Cu deposits were utilized as the nucleation sites for the subsequent ED (i.e., overplating) process to improve the electrical conductivity on the commercial polymeric substrates. 27 Moreover, particle impingement studies on the polyamide (Nylon 6) plates were conducted through numerical modeling to investigate the effect of CS settings on the creation of a catalytic surface for triggering the subsequent ED process. 28 Considering recent advances in rapid prototyping technology, the same hybrid metallization approach could synergistically shift the paradigm from an environmentally conscious process (e.g., acid treatment) to an eco-friendly and low-cost process along with many significant advantages, including the making of near-net-shaped parts.…”

Section: ■ Introductionmentioning

confidence: 99%

“…To this end, the present study aims to adopt the initially proposed CS-based hybrid metallization approach 27 for functional surface metallization on 3-D printed freeform ABS and PLA parts. The main objectives of this work are to (1) establish and adopt a complete additive surface metallization route that enables rapid and eco-friendly metallization of 3Dprinted parts in an etching-free manner, (2) perform a fundamental study of the CS-assisted electroless deposition approach, and (3) demonstrate the viability of the proposed route for polymer electronics.…”

Section: ■ Introductionmentioning

confidence: 99%

“…26 Recently, the authors' group have addressed this issue by developing a CS-based hybrid surface metallization approach, which relies on the integration of the CS and ED processes. 27,28 In this regard, the as-CS Cu deposits were utilized as the nucleation sites for the subsequent ED (i.e., overplating) process to improve the electrical conductivity on the commercial polymeric substrates. 27 Moreover, particle impingement studies on the polyamide (Nylon 6) plates were conducted through numerical modeling to investigate the effect of CS settings on the creation of a catalytic surface for triggering the subsequent ED process.…”

Section: ■ Introductionmentioning

confidence: 99%

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Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

Akin,

Nath,

Jun

2023

ACS Appl. Electron. Mater.

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Selective surface metallization of insulating polymers is of particular interest in smart films, energy harvesting, and sensing applications. However, traditional polymer metallization techniques face challenges due to the need for environmentally hazardous pretreatment (e.g., strong acid etching) and costintensive palladium seeding processes, thereby limiting the largescale deployment of metallized polymers. With the advent of rapid prototyping, metallization on additively manufactured polymers drew attention in a variety of technological applications, as it enables the fabrication of low-cost electronic devices. In the current work, we deploy and evaluate a hybrid additive metallization route that can enable the fabrication of functional selective metallization on 3D-printed polymers in a rapid and eco-friendly methodology with improved electrical conductivity. The metallization route sequentially comprises (1) material extrusion 3D printing, (2) cold spray metallization, and (3) electroless deposition. The resulting metal (copper) layers on the polymer surfaces are characterized in terms of the microstructure, surface chemistry, wettability, and electrical conductivity. Notably, selective metallization with promising electrical conductivity (i.e., 6.47 × 10 6 S m −1 for ABS and 5.27 × 10 6 S m −1 for PLA parts) is achieved on both linear and curvilinear polymer surfaces. Moreover, strong adhesion between the metallized layer and the 3Dprinted structures was confirmed by adhesion tests. Detailed evaluation of the proposed hybrid metallization route unlocks great potential to advance the field of conductive surface metallization on 3D-printed polymers.

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Fabrication of Electrically Conductive Patterns on Acrylonitrile-Butadiene-Styrene Polymer Using Low-Pressure Cold Spray and Electroless Plating

Cited by 3 publications

References 28 publications

Fully Additively Manufactured Counter Electrodes for Dye-Sensitized Solar Cells

Fully Additively Manufactured Counter Electrodes for Dye-Sensitized Solar Cells

Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs

Selective Surface Metallization of 3D-Printed Polymers by Cold-Spray-Assisted Electroless Deposition

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