Fabrication of Al2O3/glass/Cf Composite Substrate with High Thermal Conductivity

Wang, Shikai; Liu, G. S.; Ouyang, Xue; Wang, Y. D.; Zhang, D.

doi:10.1007/s11665-015-1862-x

Cited by 11 publications

(11 citation statements)

References 17 publications

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“…Moreover, the CNTs were easily found in this specimen, as shown in the inset of Figure D. According to previous studies, Al 2 O 3 reacted with C at approximately 960°C and formed CO 2 : 2Al 2 O 3 + 3C → 4Al + 3CO 2 . Therefore, the Al 2 O 3 powders in the composite are considered to have reacted with the CNTs during sintering at 950°C, forming the CO 2 gas and resulting in the formation of a porous microstructure in the composite sintered at 950°C.…”

Section: Resultsmentioning

confidence: 52%

“…4Al + 3CO 2 . 48,49 Therefore, the Al 2 O 3 powders in the composite are considered to have reacted with the CNTs during sintering at 950°C, forming the CO 2 gas and resulting in the formation of a porous microstructure in the composite sintered at 950°C. However, for the composite sintered at 900°C, the Al 2 O 3 powders did not react with the CNTs and formed a dense microstructure.…”

Section: Resultsmentioning

confidence: 99%

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Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

Lee

Cho

Lee³

et al. 2018

J Am Ceram Soc

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A CaO‐B2O3‐SiO2 (CBS) glass/40 wt% Al2O3 composite sintered at 900°C exhibited a dense microstructure with a low porosity of 0.21%. This composite contained Al2O3 and anorthite phases, but pure glass sintered at 900°C has small quantities of wollastonite and diopside phases. This composite was measured to have a high bending strength of 323 MPa and thermal conductivity of 3.75 W/(mK). The thermal conductivity increased when the composite was annealed at 850°C after sintering at 900°C, because of the increase in the amount of the anorthite phase. 0.25 wt% graphene oxide and 0.75 wt% multi‐wall carbon nanotubes were added to the CBS/40 wt% Al2O3 composite to further enhance the thermal conductivity and bending strength. The specimen sintered at 900°C and subsequently annealed at 850°C exhibited a large bending strength of 420 MPa and thermal conductivity of 5.51 W/(mK), indicating that it would be a highly effective substrate for a chip‐type supercapacitor.

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Section: Resultsmentioning

confidence: 52%

Section: Resultsmentioning

confidence: 99%

Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

Lee

Cho

Lee³

et al. 2018

J Am Ceram Soc

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“…It is worthy of note that the thermal conductivity of the Al 2 O 3 /30glass/30Cu f composite substrate by low-temperature sintering was also higher than that of Al 2 O 3 /30glass/30C f (28.98 W/mK) [16], although the thermal conductivity of C fiber is higher than that of Cu fiber. The thermal conduction enhancement mechanism of Al 2 O 3 /30glass/30Cu f composite substrate not only differs with that of Al 2 O 3 /30glass/30Cu p composite substrate, but also differs from that of Al 2 O 3 /30glass/30C f composite substrate.…”

Section: Resultsmentioning

confidence: 99%

“…The thermal conduction enhancement mechanism of Al 2 O 3 /30glass/30Cu f composite substrate not only differs with that of Al 2 O 3 /30glass/30Cu p composite substrate, but also differs from that of Al 2 O 3 /30glass/30C f composite substrate. Similar to the carbon fiber 3D network in Al 2 O 3 /30glass/30C f composite [16], Cu f can form a bridging 3D network in the Al 2 O 3 /30glass/30Cu f composite substrate, which would enhance the thermal conductivity effectively. When sintered at 850 °C under a pressure of 25 MPa, Cu f was etched by the melted glass at local surface, leading to welding bridging in the overlapped fibers.…”

Section: Resultsmentioning

confidence: 99%

“…In the traditional hot-press process, fibers or whiskers in the matrix are rotated under pressure and preferentially aligned parallel to the sample’s surface. To avoid the preferential alignment of the copper fiber and form a three-dimensional (3D) network in the Al 2 O 3 /glass green matrix [16], a hot-press process with multi-stage pressure was employed, as shown in Figure 1.…”

Section: Methodsmentioning

confidence: 99%

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Al2O3-Cu Substrate with Co-Continuous Phases Made by Powder Sintering Process

et al. 2018

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Ceramic-Al substrates with co-continuous ceramic and metal phases, which exhibit high thermal conductivity and compatible coefficient of thermal expansion (CTE), have been widely investigated through the process of die-casting. In this research, a kind of powder sintering process was proposed for fabricating ceramic-Cu composite substrates with co-continuous phases. Copper fiber (Cuf) has excellent thermal conductivity and large aspect ratio, making it an ideal material to form bridging network structures in the ceramic-Cu composite. To maintain the large aspect ratio of Cuf, and densify the composite substrate, ZnO-SiO2-CaO glass was introduced as a sintering additive. Both Al2O3/glass/Cuf and Al2O3/30glass/Cup composite substrates were hot-pressed at 850 °C under 25 MPa. Experimental results showed that the thermal conductivity of Al2O3/30glass/30Cuf composite substrate was as high as 38.9 W/mK, which was about 6 times that of Al2O3/30glass; in contrast, the thermal conductivity of Al2O3/30glass/30Cup composite substrate was only 25.9 W/mK. Microstructure observation showed that, influenced by hot press and corrosion of molten ZnO-SiO2-CaO glass, the copper fibers were deformed under hot-pressing, and some local melting-like phenomena occurred on the surface of copper fiber at 850 °C under 25 MPa. The molten phase originating from surface of Cuf welded the overlapping node of copper fibers during cooling process. Finally, the interconnecting metal bridging in ceramic matrix was formed and behaved as a rapid heat-dissipating channel, which is similar to substrates prepared through die-casting process by porous ceramic and melted Al.

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High Performance of Low‐Temperature‐Cofired Ceramic with Al₂O₃/BN Biphasic Ceramics Based on B₂O₃–Bi₂O₃–SiO₂–ZnO Glass

et al. 2020

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With the rapid development of microelectronic information technology, highpower electronic devices require high heat dissipation. Herein, the preparation of low-temperature cofired ceramic (LTCC) applications with excellent thermal conductivity and dielectric properties is focused. B 2 O 3 -Bi 2 O 3 -SiO 2 -ZnO (BBSZ) glass/Al 2 O 3 /BN green sheets are prepared by tape casting and sintered at 850 C. The crystal phase composition, microstructure, thermal conductivity, thermal expansion coefficient, and dielectric properties of LTCC are investigated. It is shown that nanoscale rod crystals ZnAl 2 O 4 and Bi are formed in the composite. The generated nanoscale rod crystals build a 3D heat conduction channel in the composite. The thermal conductivity of the sintered sheet with 20 wt% BN is 5.165 W m À1 K À1 . The sintered sheet containing 20 wt% BN has a low coefficient of thermal expansion (2.92 ppm C À1 ) matched well with silicon and excellent dielectric properties (ε r ¼ 3.9672, tan δ ¼ 1.49 Â 10 À3 ) at 20 GHz. This material has great potential applications in electronic devices.

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Fabrication of Al2O3/glass/Cf Composite Substrate with High Thermal Conductivity

Cited by 11 publications

References 17 publications

Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

Al2O3-Cu Substrate with Co-Continuous Phases Made by Powder Sintering Process

High Performance of Low‐Temperature‐Cofired Ceramic with Al₂O₃/BN Biphasic Ceramics Based on B₂O₃–Bi₂O₃–SiO₂–ZnO Glass

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Fabrication of Al2O3/glass/Cf Composite Substrate with High Thermal Conductivity

Cited by 11 publications

References 17 publications

Carbon nanotube/graphene oxide‐added CaO‐B2O3‐SiO2 glass/Al2O3 composite as substrate for chip‐type supercapacitor

Carbon nanotube/graphene oxide‐added CaO‐B2O3‐SiO2 glass/Al2O3 composite as substrate for chip‐type supercapacitor

Al2O3-Cu Substrate with Co-Continuous Phases Made by Powder Sintering Process

High Performance of Low‐Temperature‐Cofired Ceramic with Al2O3/BN Biphasic Ceramics Based on B2O3–Bi2O3–SiO2–ZnO Glass

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Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

High Performance of Low‐Temperature‐Cofired Ceramic with Al₂O₃/BN Biphasic Ceramics Based on B₂O₃–Bi₂O₃–SiO₂–ZnO Glass