Carbon nanotube/graphene oxide‐added CaO‐B₂O₃‐SiO₂ glass/Al₂O₃ composite as substrate for chip‐type supercapacitor

Abstract

A CaO‐B2O3‐SiO2 (CBS) glass/40 wt% Al2O3 composite sintered at 900°C exhibited a dense microstructure with a low porosity of 0.21%. This composite contained Al2O3 and anorthite phases, but pure glass sintered at 900°C has small quantities of wollastonite and diopside phases. This composite was measured to have a high bending strength of 323 MPa and thermal conductivity of 3.75 W/(mK). The thermal conductivity increased when the composite was annealed at 850°C after sintering at 900°C, because of the increase in the amount of the anorthite phase. 0.25 wt% graphene oxide and 0.75 wt% multi‐wall carbon nanotubes were added to the CBS/40 wt% Al2O3 composite to further enhance the thermal conductivity and bending strength. The specimen sintered at 900°C and subsequently annealed at 850°C exhibited a large bending strength of 420 MPa and thermal conductivity of 5.51 W/(mK), indicating that it would be a highly effective substrate for a chip‐type supercapacitor.

Microwave dielectric characterization and densification mechanism analysis of CaO‐B2O3‐SiO2 glass–ceramic/Al2O3 composites for LTCC applications

“…To better understand the inherent characteristics of dielectric microwave ceramics in a 5G application environment, the proposed design idea of the glass composition was different from that of commercial high‐proportion glass (40–80 vol%), 11 and a low‐proportion glass content (10–30 vol%) was used.…”

Improved the Comprehensive Properties of Low‐Temperature Co‐Fired Ceramic Composites Based on ZnO–B2O3–Na2O–Al2O3–SiO2 Glass by Introducing AlN Nano particles

“…At present, the most common commercial LTCC material is Al 2 O 3 /glass composite, whose thermal conductivity is usually very low, generally only 2–4 W m −1 K −1 . [ 5,6 ] This limits its application in the devices with high heat dissipation requirement. As a ceramic filler, AlN has attracted more and more attention due to its high thermal conductivity (268–374 W m −1 K −1 at room temperature), and electrical resistivity, large direct bandgap, low dielectric constant, and a coefficient of thermal expansion (CTE) matched with silicon.…”

High Performance of Low‐Temperature‐Cofired Ceramic with Al2O3/BN Biphasic Ceramics Based on B2O3–Bi2O3–SiO2–ZnO Glass

“…Its thermal conductivity is increased by 4.56 times, the thermal expansion coefficient is 4.66 ppm °C −1 , and the dielectric constant is 7.3 . It is helpful to add 1D material with highly thermally conductive materials such as carbon nanotubes, graphene oxide, and carbon fiber to the LTCC material to improve heat conduction. Moreover, it is also feasible to prepare a multiceramics system to improve heat conduction which can achieve a synergistic effect.…”