High Performance of Low‐Temperature‐Cofired Ceramic with Al2O3/BN Biphasic Ceramics Based on B2O3–Bi2O3–SiO2–ZnO Glass

Feng, Xiangyan; Liu, Yuanyuan; Zhang, Lan; Ding, Jianwei; Sun, Jun; Li, Xiaoxiao; Lin, Chen; Zheng, Kang; Zhang, Xian; Tian, Xingyou

doi:10.1002/adem.201901486

Cited by 18 publications

(5 citation statements)

References 32 publications

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“…This is an important step as the presence of a redundant coupling agent results in phonon scattering. [ 4 ] The hBN particles thus obtained are further dried for another 12 h at 100°C to finally obtain surface‐modified hBN which can be used for the preparation of the composite body.…”

Section: Methodsmentioning

confidence: 99%

“…[1,2] To achieve this, the electronic devices must fulfill certain conditions like high energy density, quick and effective heat dissipation, low dielectric constant, and fast signal transmission. [3,4] Out of this, effective heat dissipation followed by a low dielectric constant is of prime importance. The main heat-generating components in electronic devices are chips, light-emitting diodes, and radio frequency power devices.…”

Section: Introductionmentioning

confidence: 99%

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Fabrication and characterization of hexagonal boron nitride/polyester composites to study the effect of filler loading and surface modification for microelectronic applications

Kushwaha

Patel

Khan³

et al. 2023

Polymer Composites

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This work investigates a composite prepared with polyester and hexagonal boron nitride (hBN) in terms of the properties required in the material for microelectronics applications. The influence of filler loading and the surface treatment of hBN with a silane coupling agent (γ‐aminopropyl triethoxy silane) is studied. It has been observed that the silane‐modified hBN improves the compatibility and adhesion with the matrix as verified by SEM images. The experimental investigation reveals that the addition of hBN in polyester unwillingly rises the density, voids content, and water absorption rate. Though, the increment is limited with surface‐modified hBN. The material's mechanical properties improve with filler loading over a particular range of filler loading. The material's thermal conductivity and glass transition temperature increase with hBN content, whereas the coefficient of thermal expansion reduces. Polyester when filled with 40 wt% of the silane‐hBN, the thermal conductivity improves around six times that of unfilled polyester. The dielectric properties are marginally augmented with filler loading whereas, the increase in frequency results in the reduction of dielectric properties. It can be observed from the overall experimental analysis that the developed material can be used in different microelectronic applications. Highlights A new class of composite is developed with polyester and raw/modified hBN. Composite with modified hBN shows improved physical/mechanical properties. Thermal properties of polyester improved appreciably with treated hBN. The dielectric properties of composites remain well within the range. The fabricated composites are recommended for microelectronics applications.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Fabrication and characterization of hexagonal boron nitride/polyester composites to study the effect of filler loading and surface modification for microelectronic applications

Kushwaha

Patel

Khan³

et al. 2023

Polymer Composites

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“…The number of closed pores increased as the amount of Al 2 O 3 increased, as illustrated in Figure 4 a,b; when the amount of ZrO 2 was decreased from 40 wt.% to 30 wt.%, the number of closed pores decreased ( Figure 4 e,f). It has already been reported that having a large number of closed pores is harmful to the thermal conductivity of the material and hence the performance of the sintered products [ 32 ]. Closed porosity is seen in the microstructure of the 30Al-O and 40Al-O samples, as shown in Figure 4 a,b.…”

Section: Resultsmentioning

confidence: 99%

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

et al. 2023

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Various glass-ceramics are widely used or considered for use as components of microelectronic materials due to their promising properties. In this study, borosilicate glass was prepared using the powder metallurgical route and then mixed with different amounts of Al2O3 and ZrO2 filler materials. Glass-ceramics are produced by high-energy ball milling and conventional sintering process under Ar or air. In this study, the effects of different filler materials and different atmospheres on the microstructural, thermal and dielectric properties were investigated. The data showed that ZrO2 filler material led to better results than Al2O3 under identical working conditions and similar composite structures. ZrO2 filler material significantly enhanced the densification process of glass-ceramics (100% relative density) and led to a thermal conductivity of 2.904 W/K.m, a dielectric constant of 3.97 (at 5 MHz) and a dielectric loss of 0.0340 (at 5 MHz) for the glass with 30 wt.% ZrO2 sample. This paper suggests that prepared borosilicate glass-ceramics have strong sinterability, high thermal conductivity, and low dielectric constants, making them promising candidates for microelectronic devices.

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“…% BN reduced not only the apparent and open porosity but also the closed pores in the microstructure. It has already been reported that a large number of closed pores is harmful to the thermal conductivity of the material and, hence, the performance of sintered products [ 42 ].…”

Section: Resultsmentioning

confidence: 99%

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

Arıbuğa

Akkasoglu²,

Çiçek

et al. 2022

Materials

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With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics’ sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40–4.43, providing a potential candidate for various electronic applications.

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High Performance of Low‐Temperature‐Cofired Ceramic with Al₂O₃/BN Biphasic Ceramics Based on B₂O₃–Bi₂O₃–SiO₂–ZnO Glass

Cited by 18 publications

References 32 publications

Fabrication and characterization of hexagonal boron nitride/polyester composites to study the effect of filler loading and surface modification for microelectronic applications

Fabrication and characterization of hexagonal boron nitride/polyester composites to study the effect of filler loading and surface modification for microelectronic applications

Effect of Al2O3 and ZrO2 Filler Material on the Microstructural, Thermal and Dielectric Properties of Borosilicate Glass-Ceramics

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

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