Fabrication and properties of tungsten-copper alloy reinforced by titanium-coated silicon carbide whiskers

Xu, Zengshi; Shi, Xiaoliang; Zhai, Wenzheng; Wang, Yufu; Zhang, Song

doi:10.1177/0021998314536451

Cited by 6 publications

(6 citation statements)

References 39 publications

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“…The effect of sputtering time on the thermal conductivity of the composite is shown in Table 5, with the increase of magnetron sputtering time, the thermal conductivity of the composite material shows a trend of first increasing and then decreasing, and the main reason for the decrease in thermal conductivity is that with the extension of magnetron sputtering time, the thickness of Mo coating increases, but the thermal conductivity of Mo itself is smaller than that of Cu and SiC. Xu et al [119] fabricated Titanium(Ti)-coated SiCw/W-20Cu composites using hotpress sintering. Ti-coated SiCw, as shown in Figure 6, resulted in dense and uniformly structured SiCw/W-20Cu composites, partially suppressing the reaction between Cu and SiC.…”

Section: Methodsmentioning

confidence: 97%

“…Ti-coated SiCw, as shown in Figure 6, resulted in dense and uniformly structured SiCw/W-20Cu composites, partially suppressing the reaction between Cu and SiC. Xu et al [119] fabricated Titanium(Ti)-coated SiCw/W-20Cu composites using hotpress sintering. Ti-coated SiCw, as shown in Figure 6, resulted in dense and uniformly structured SiCw/W-20Cu composites, partially suppressing the reaction between Cu and SiC.…”

Section: Methodsmentioning

confidence: 99%

“…Xu et al [ 119 ] fabricated Titanium(Ti)-coated SiCw/W-20Cu composites using hot-press sintering. Ti-coated SiCw, as shown in Figure 6 , resulted in dense and uniformly structured SiCw/W-20Cu composites, partially suppressing the reaction between Cu and SiC.…”

Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning

confidence: 99%

See 2 more Smart Citations

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

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With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requirements of high-performance chips. High thermal conductivity (TC), low coefficient of thermal expansion (CTE), good mechanical properties, and a rich foundation in microfabrication techniques are the fundamental requirements for the next generation of electronic packaging materials. Currently, metal matrix composites (MMCs) composed of high TC matrix metals and reinforcing phase materials have become the mainstream direction for the development and application of high-performance packaging materials. Silicon carbide (SiC) is the optimal choice for the reinforcing phase due to its high TC, low CTE, and high hardness. This paper reviews the research status of SiC-reinforced aluminum (Al) and copper (Cu) electronic packaging materials, along with the factors influencing their thermo-mechanical properties and improvement measures. Finally, the current research status and limitations of conventional manufacturing methods for SiC-reinforced MMCs are summarized, and an outlook on the future development trends of electronic packaging materials is provided.

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Section: Methodsmentioning

confidence: 97%

Section: Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

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“…In summary, SiC whiskers (SiCw) are very effective nickel-based composite materials for the reinforcing phase. However, whisker-reinforced metal matrix composites are mainly prepared by conventional hot pressing [ 32 ], squeeze casting [ 33 ], and spark plasma sintering [ 34 ]. It is difficult for these traditional powder metallurgy and other preparation processes to be compatible with MEMS processes.…”

Section: Introductionmentioning

confidence: 99%

Application of Ni/SiCw Composite Material in MEMS Microspring

Lai,

Yu,

Wang

et al. 2023

Micromachines

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The microspring is a typical type of device in MEMS devices, with a wide range of application scenarios and demands, among which a popular one is the microelectroformed nickel-based planar microspring prepared by the UV-LIGA technology based on the SU-8 adhesive. It is worth noting that the yield strength of the electrodeposited nickel microstructure is low, and the toughness of the structure is not high, which is unbeneficial for the enduring and stable operation of the spring. The paper mainly presents the methods of preparing high-aspect-ratio Ni/SiCw microstructures for MEMS devices based on UV-LIGA technology, developing Ni/SiCw-based microspring samples with a thickness of 300 μm, and applying a DMA tensile tester for mechanical property tests and characterization. In addition, the paper explores the influence of heat treatment at 300 °C and 600 °C on the tensile properties and microstructure of composite coatings. The results show that the W-form microspring prepared from Ni/SiCw composites not only has a wider linear range (about 1.2 times wider) than that of pure nickel material but also has a stronger resistance capacity to plastic deformation, which is competent for MEMS device applications in environments below 300 °C. The research provides a frame of reference and guidance for improving the stable cyclic operating life of such flat springs.

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“…17 Later, they were applied in electronic devices such as sensors, filed emitting diodes and solar cells. 18 Currently, whiskerreinforced metal matrix composites are mostly produced by conventional hot pressing, 19 squeeze casting 20 and spark plasma sintering, 16 z E-mail: gfding@sjtu.edu.cn which all need to be performed in high temperature and high pressure (HTHP) environments. These methods are not only costly but may also alter the microstructure, which can be detrimental to the mechanical properties of the composite material.…”

mentioning

confidence: 99%

Microfabrication and Characterization of High Tensile Strength SiC Whisker-Reinforced Nickel Composite Coatings by Electrodeposition

Lai

et al. 2019

J. Electrochem. Soc.

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Metal matrix composite materials with SiC whiskers are considered as the reinforcement materials for the future electronic devices. However, today, these materials are mostly produced at high temperature and high pressure (HTHP) environments, these procedures are not only costly but may also alter the microstructure. In order to explore an economically more viable approach of fabrication of multilayer movable complicated microstructures, SiC whiskers-reinforced nickel matrix composites (Ni/SiCw) coatings were prepared by electrolytic co-deposition method. The surface morphology and mechanical properties of the electrodeposited coatings, fabricated in both absence and presence of SiC whisker, were studied. Morphology studies showed a homogenous presence of the whisker intercalated at the surface of the nickel matrix; this was further confirmed from the results of XPS and TEM, which also demonstrated that the insertion of the whisker went from the surface to inside. Moreover, it was found that the embedded whiskers significantly affect mechanical properties of the composite coatings: the ultimate tensile strength of Ni/SiCw composite was 2.6 times higher than that of pure Ni, and the elastic modulus improved by 42% with 0.8 g/L of SiC whiskers in the bath. These results reveal the promising potential of electrodeposited metal-SiC whiskers composite materials for micro-mechanical devices application.

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Fabrication and properties of tungsten-copper alloy reinforced by titanium-coated silicon carbide whiskers

Cited by 6 publications

References 39 publications

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Application of Ni/SiCw Composite Material in MEMS Microspring

Microfabrication and Characterization of High Tensile Strength SiC Whisker-Reinforced Nickel Composite Coatings by Electrodeposition

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