2006
DOI: 10.1016/j.mee.2005.10.043
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Fabrication and characterization of 4H-SiC planar MESFETs

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Cited by 42 publications
(15 citation statements)
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“…The bias conditions of Vgs = -15 V and the frequency of 2 GHz were considered in our simulation. It should be noted that the simulated Cgd are in good agreement with the experimental results measured at the same Vd, [12]. with and without source field plate As compared to the conventional structures without field plate, the MESFETs with source field plate show an approximately 410% decrease in Cgd at VdS = 40 V, which is responsible for the 2.2 dB MSG/MAG improvement.…”
Section: Detailed Text Formattingsupporting
confidence: 79%
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“…The bias conditions of Vgs = -15 V and the frequency of 2 GHz were considered in our simulation. It should be noted that the simulated Cgd are in good agreement with the experimental results measured at the same Vd, [12]. with and without source field plate As compared to the conventional structures without field plate, the MESFETs with source field plate show an approximately 410% decrease in Cgd at VdS = 40 V, which is responsible for the 2.2 dB MSG/MAG improvement.…”
Section: Detailed Text Formattingsupporting
confidence: 79%
“…DC Characteristics Fig. 2 shows the simulated and experimental drain currentvoltage (Ids-VdS) characteristics under the gate bias (Vgs) varied from -4 to -19 V in a step of -5 V. It should be noted that the simulated results of the conventional MESFET without field plate are in good agreement with the experimental data [12]. As is seen from the figure, Ids of the proposed structure with the 1.l,m long source field plate is almost the same as that of the conventional structure at various Vgs.…”
Section: Detailed Text Formattingmentioning
confidence: 63%
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“…The simulated and experimental [8] data of dc drain current-voltage (I DS vs. V DS ) are depicted in Fig2. The gate bias voltage varied from -4V to -19V in a step of -5V.…”
Section: A DC Characteristicsmentioning
confidence: 99%
“…The CG-MESFET has a clival gate instead of the conventional gate, and the manufacturing processes of substrate, p-buffer and channel are same as conventional 4H-SiC MESFET [9]. So, the key process is manufacturing the clival gate in the channel, which can take the example of fabricating the recessed gate area of the transistors as reported in [10]. Firstly, with electronic beam lithography and etching on the channel region between the gate and source, the gate region length will be defined.…”
Section: Introductionmentioning
confidence: 99%