Abstract:Nozzles with micro and nanometer scale orifices are playing an increasingly important role in many micro and nano devices, processes and characterization applications such as cell sorters, micro deposition of structures and near-field optical scanning. This paper describes a new process that can generate nozzles in a silicon substrate with nozzle walls of silicon nitride and oxide and with protudent geometry around the nozzle orifice. The fabrication process exploits a combination of geometry and differences i… Show more
“…An important parameter to consider is texturization of the surfaces characterized by the presence of micropyramids resulting from the re-deposition of the reaction products as well as the presence of H 2 bubbles acting as “micro-masks” [ 34 - 37 ]. It is known that these artifacts can be minimized through the use of highly concentrated hydroxide solutions (up to 15 M) at temperatures up to 85 °C with or without the addition of isopropyl alcohol (IPA) [ 12 , 35 - 36 ].…”
We present a simplified, highly reproducible process to fabricate arrays of tapered silicon micro-funnels and micro-channels using a single lithographic step with a silicon oxide (SiO2) hard mask on at a wafer scale. Two approaches were used for the fabrication. The first one involves a single wet anisotropic etch step in concentrated potassium hydroxide (KOH) and the second one is a combined approach comprising Deep Reactive Ion Etch (DRIE) followed by wet anisotropic etching. The etching is performed through a 500 μm thick silicon wafer, and the resulting structures are characterized by sharp tapered ends with a sub-micron cross-sectional area at the tip. We discuss the influence of various parameters involved in the fabrication such as the size and thickness variability of the substrate, dry and wet anisotropic etching conditions, the etchant composition, temperature, diffusion and micro-masking effects, the quality of the hard mask in the uniformity and reproducibility of the structures, and the importance of a complete removal of debris and precipitates. The presence of apertures at the tip of the structures is corroborated through current voltage measurements and by the translocation of DNA through the apertures. The relevance of the results obtained in this report is discussed in terms of the potential use of these structures for stochastic sensing.
“…An important parameter to consider is texturization of the surfaces characterized by the presence of micropyramids resulting from the re-deposition of the reaction products as well as the presence of H 2 bubbles acting as “micro-masks” [ 34 - 37 ]. It is known that these artifacts can be minimized through the use of highly concentrated hydroxide solutions (up to 15 M) at temperatures up to 85 °C with or without the addition of isopropyl alcohol (IPA) [ 12 , 35 - 36 ].…”
We present a simplified, highly reproducible process to fabricate arrays of tapered silicon micro-funnels and micro-channels using a single lithographic step with a silicon oxide (SiO2) hard mask on at a wafer scale. Two approaches were used for the fabrication. The first one involves a single wet anisotropic etch step in concentrated potassium hydroxide (KOH) and the second one is a combined approach comprising Deep Reactive Ion Etch (DRIE) followed by wet anisotropic etching. The etching is performed through a 500 μm thick silicon wafer, and the resulting structures are characterized by sharp tapered ends with a sub-micron cross-sectional area at the tip. We discuss the influence of various parameters involved in the fabrication such as the size and thickness variability of the substrate, dry and wet anisotropic etching conditions, the etchant composition, temperature, diffusion and micro-masking effects, the quality of the hard mask in the uniformity and reproducibility of the structures, and the importance of a complete removal of debris and precipitates. The presence of apertures at the tip of the structures is corroborated through current voltage measurements and by the translocation of DNA through the apertures. The relevance of the results obtained in this report is discussed in terms of the potential use of these structures for stochastic sensing.
“…64 Copyright 2019, Springer Nature. (b) Parallel nozzle array: integrated metal nozzles, 77 Copyright 2018, AIP Publishing; etched cylindrical silicon nozzles, 78 Copyright 2017, IOP Publishing; etched pyramid silicon nozzles, 81 Copyright 2017, IOP Publishing; machined metal nozzles, 83 Copyright 2013, Taylor & Francis; 3D printed electrospinning, 84 Copyright 2017, IOP Publishing; and electrospray 85 nozzles, Copyright 2017, Royal Society of Chemistry. (c) Addressable nozzle array with different controlling methods: by rotating the individual nozzle, 86 Copyright 2012, IOP Publishing; or by controlling the potential of the ring electrodes, 87 Copyright 2015, AIP Publishing.…”
Section: Ink Engineering and Process Optimizationmentioning
confidence: 99%
“…Assembling a plurality of stainless-steel nozzles or glass capillaries into a nozzle array is a simple and effective method, 77 but these coarse nozzle arrays with mm-level spacing cannot meet the requirements for high density and accuracy. Using MEMS-based techniques to prepare high-precision glass or silicon nozzle arrays has gradually become a focus, and various high-precision cylindrical [78][79][80] and pyramid-shaped nozzle arrays 81 have been fabricated. Besides MEMS-based technology, special processing techniques like laser etching, 82 micro-machining 83 and high-precision 3D printing 84,85 also show tremendous potential in EHD nozzle array fabrication.…”
The rapid development of fascinating new optoelectronic materials and devices calls for innovative production of micro/nanostructures in a high-resolution, large-scale, low-cost fashion, preferably compatible with flexible/wearable applications. Powerful electrohydrodynamic (EHD)...
“…Pan et al 31 fabricated silicon multi-nozzles by photolithography and etching. Mukhopadhyay et al 32 developed high-precision pyramid-shaped nozzle arrays with a rectangle outlet on a silicon substrate. Ohigashi et al 33 utilized a MEMS micromachining process to develop nozzle arrays with a small inner/outer diameter and nozzle spacing.…”
Electrohydrodynamic (EHD) printing is a promising micro/nano fabrication technique, due to its ultra-high resolution and wide material applicability. However, it suffers from printing efficiency which urgently calls for a high...
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