Experimental testing of thermal interface materials on non-planar surfaces

Optimization of Thermal Interface Materials for Electronics Cooling Applications

“…Most of the past work on TIMs has been targeted toward experimental determination of the effects of parameters such as contact pressure, filler volume fraction, TIM layer thickness and nonplanarity of the contacting surfaces on the thermal conductivity of TIMs [2]- [5]. Devpura et al [6], [7] used percolation theory to model TIMs, and investigated the influence of changes in parameters such as the ratio of conductivity of the filler particles to that of the matrix material, filler volume fraction, TIM layer thickness and shape and size of the filler particles on the thermal conductivity.…”

Thermal contact resistance of various carbon nanomaterial-based epoxy composites developed for thermal interface applications

“…Introduction Thermal interface materials (TIMs) are a vital component of electronic packaging as they facilitate heat removal from microchips by improving thermal contact between the mating surfaces of chip and heat-sink [1,2]. Desired key characteristics of filled polymer composite TIM adhesives or pastes are high thermal conductivity, low thermal contact resistance (TCR), moderate viscosity, ease of application [3] etc.…”

Accurate measurement of interface thermal resistance by means of a transient method

“…For recent literature on steady state techniques see e.g. Chiu et al (1997), Dean & Gettings (1999), Haque & Lu (1999, Rauch (1999). Shi et al (1998) use real-time holographic interferometry to measure both the coefficient of thermal expansion and the thermal conductivity, in the range 0.2-380 W/mK, of anisotropic solid films.…”