A bismuth-silver alloy (Bi-11wt.%Ag) has been identified as a viable Pb-free power die-attach solder. The alloy has a solidus at 262.5°C and a liquidus at 360°C. It has a shear modulus of 13.28 GPa and an ultimate tensile strength (UTS) of 59 MPa. Bismuth-silver alloys oxidize in air but will solder to nickel, silver, and gold under reducing atmospheres. Germanium may be added in small amounts (Յ500 ppm) to improve the wetting. Wire, ribbon, and preform shapes of the alloy have been fabricated by conventional metalworking techniques.

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