1996
DOI: 10.1088/0960-1317/6/1/037
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Experimental characterization of dynamic micromechanical transducers

Abstract: This paper starts with a short review on interferometric methods for optical analysis of resonant structures. Three important types of resonant sensor elements are then discussed: a piezoelectrically driven beam as the strain sensitive element of a bulk micromachined force-sensor, electrothermally driven/piezoresistively detected single and triple beams as the sensing elements of a bulk micromachined resonant accelerometer, and an electrostatically driven capacitively detected torsional resonator in surface mi… Show more

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Cited by 34 publications
(34 citation statements)
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“…DRIE was developed for the manufacture of microelectromechanical systems (MEMS) and to excavate trenches for high-density capacitors for DRAM and passive integration, and for through-silicon-vias (TSVs) in advanced 3D wafer-level packaging technology. The DRIE process of choice today is the Bosch process 37,38 (Fig. 12).…”
Section: B Deep Reactive Ion Etchingmentioning
confidence: 99%
“…DRIE was developed for the manufacture of microelectromechanical systems (MEMS) and to excavate trenches for high-density capacitors for DRAM and passive integration, and for through-silicon-vias (TSVs) in advanced 3D wafer-level packaging technology. The DRIE process of choice today is the Bosch process 37,38 (Fig. 12).…”
Section: B Deep Reactive Ion Etchingmentioning
confidence: 99%
“…It has several advantages over the well known Bosch process, which is widely used in the microelectronics and the MEMS industries [2]. The latter involves scalloped profiles coated with a persistent layer.…”
Section: Introductionmentioning
confidence: 99%
“…The substrates were mechanical clamped. N 2 , Ar, O 2 , SF 6 , CF 4 and C 4 F 8 were available as process gases. The equipment enabled the realization of cyclic processes.…”
Section: Experimental Partmentioning
confidence: 99%
“…[4,5] But we aspired to etch vias with positive etch profiles and an optuse angle at the upper edge to make following deposition and filling processes easier and to prevent deposited layers from dunting or breaking. The aim of our work was the creation of holes with tapered sidewalls using an optimized positive profile etching (PPE) process.…”
Section: Introductionmentioning
confidence: 99%