1992
DOI: 10.1016/0040-6090(92)90042-a
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Evolution of surface morphology and strain during SiGe epitaxy

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Cited by 214 publications
(89 citation statements)
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“…The pressures and temperatures employed vary greatly between reactors, with values as low as 10 ±5 torr [18] and up to atmospheric pressure. [19] The growth temperature depends on the pressure and also on the Ge content, in order to prevent surface roughening or three-dimensional (3D) island growth, [20] but is normally in the range 500±600 C.…”
Section: Si 1±x Ge X Epitaxial Growth Techniquesmentioning
confidence: 99%
“…The pressures and temperatures employed vary greatly between reactors, with values as low as 10 ±5 torr [18] and up to atmospheric pressure. [19] The growth temperature depends on the pressure and also on the Ge content, in order to prevent surface roughening or three-dimensional (3D) island growth, [20] but is normally in the range 500±600 C.…”
Section: Si 1±x Ge X Epitaxial Growth Techniquesmentioning
confidence: 99%
“…LCM occurs since, in essence, large atoms tend to incorporate at surface sites with large in-plane atomic spacing and small atoms incorporate at sites with small spacing. The spatial extent of the strain variations, and presumably of the LCM, varies over a wide range scaling with the inverse square of the average strain [4].…”
Section: (Received 20 April 2000)mentioning
confidence: 99%
“…Both strain-induced roughening and the formation of a misfit dislocation network above a critical thickness (leading to crosshatch) have been described before. [12][13][14][15] …”
mentioning
confidence: 99%