“…Using large area film preparation technology, thin film strain resistance is placed on metal elastic substrate, with high precision, good creep, and strong anti-interference ability, etc. (Agarwala et al, 2017;Kirthika et al, 2017;Qiao et al, 2018;Russell et al, 2022). Through the development of new material systems and new physical mechanisms, piezoelectric thin film sensors have made great progress in sensitivity, response range, response time, linearity, hysteresis, and stability, and have shifted from the development of a single sensor to the development and optimization of the system level.…”
Piezoelectric materials have become a key component in sensors and actuators in many industrial fields, such as energy harvesting devices, self-powered structures, biomedical devices, nondestructive testing, owing to the novel properties including high piezoelectric coefficient and electromechanical coupling factors. Piezoelectric thin films integrated on silicon substrates are widely investigated for their high performance and low manufacturing costs to meet the requirement of sensor networks in internet of things (IoT). The aim of this work is to clarify the application and design structure of various piezoelectric thin films types, synthesis methods, and device processes. Based on latest literature, the process of fabricating thin film sensors is outlined, followed by a concise overview of techniques used in microelectromechanical systems (MEMS) processing that can integrate more complex functions to obtain relevant information in surrounding environment. Additionally, by addressing piezoelectric thin films sensors as a cutting-edge technology with the ability to produce self-powered electronic devices, this work delivers incisive conclusions on all aspects of piezoelectric sensor related features. A greater understanding of piezoelectricity is necessary regarding the future development and industry challenges.
“…Using large area film preparation technology, thin film strain resistance is placed on metal elastic substrate, with high precision, good creep, and strong anti-interference ability, etc. (Agarwala et al, 2017;Kirthika et al, 2017;Qiao et al, 2018;Russell et al, 2022). Through the development of new material systems and new physical mechanisms, piezoelectric thin film sensors have made great progress in sensitivity, response range, response time, linearity, hysteresis, and stability, and have shifted from the development of a single sensor to the development and optimization of the system level.…”
Piezoelectric materials have become a key component in sensors and actuators in many industrial fields, such as energy harvesting devices, self-powered structures, biomedical devices, nondestructive testing, owing to the novel properties including high piezoelectric coefficient and electromechanical coupling factors. Piezoelectric thin films integrated on silicon substrates are widely investigated for their high performance and low manufacturing costs to meet the requirement of sensor networks in internet of things (IoT). The aim of this work is to clarify the application and design structure of various piezoelectric thin films types, synthesis methods, and device processes. Based on latest literature, the process of fabricating thin film sensors is outlined, followed by a concise overview of techniques used in microelectromechanical systems (MEMS) processing that can integrate more complex functions to obtain relevant information in surrounding environment. Additionally, by addressing piezoelectric thin films sensors as a cutting-edge technology with the ability to produce self-powered electronic devices, this work delivers incisive conclusions on all aspects of piezoelectric sensor related features. A greater understanding of piezoelectricity is necessary regarding the future development and industry challenges.
“…Cui and Zhang [13] analyzed the minimum load for sliding and the maximum critical load for the overheating of rolling bearings based on the self-developed high-speed rolling bearing test bench. Russell et al [14] conducted an experimental study on the effects of bearing fitting on the bearing internal clearance. They used thin-film sensors to evaluate the load distribution based on a series of unmodified test bearings.…”
Bearing is an important transmission component of aero-engine under high-speed and heavy-load conditions. To design a roller bearing with high loading capacity and reliability, it is essential to pay attention to the relationship between external load state (reaction force) and internal load distribution (load distribution). Therefore, a measurement method for bearing reaction force is proposed in this study via load distribution and radial basis function neural network. Different from conventional static reaction force measurement methods, both of direction and magnitude of the reaction force were considered in the proposed method without modifications to bearing. Firstly, an experimental system was designed to investigate the load distribution in a roller bearing under different reaction forces using strain variation measurement. Then, finite element analysis was conducted and simulation results of the strain variations at three interested points match well with the experimental measurements. Finally, radial basis function neural network with strong nonlinear fitting ability is applied to construct the mapping relationship between strain variation and reaction force. The results show that the proposed method can predict the reaction force with high accuracy based on the strain variation at three measuring points.
“…The sensors manufactured by Tekscan have been used in the studies on the pressures in the soil [ 3 , 4 , 5 , 6 , 7 ], railroad track pressure [ 8 ], pressure in the joints [ 9 , 10 ], pressure by medical pressure garments and socks [ 11 , 12 , 13 ], pressure when gripping tools and handles [ 14 , 15 , 16 ], pressures between rolling elements [ 17 ] and others. This variability of applications is provided by the very small thickness of the sensors (usually 0.1–0.3 mm), their flexibility and relative unpretentiousness to external conditions.…”
Section: Introductionmentioning
confidence: 99%
“…Calibration of tactile pressure sensors is carried out using loading machines [ 8 , 9 , 17 , 19 , 20 ], pneumatic devices [ 11 , 12 ] and dead weights [ 12 , 16 , 21 ].…”
A simple and cost-effective calibration procedure for piezoresistive ink tactile pressure sensors is crucial for their use in geotechnical research applications. Such a procedure should be applicable in field conditions and require a minimum amount of equipment. The paper describes a new method for calibrating tactile pressure sensors with 8-bit sensels’ output. The method is based on the approximation of a single sensel output and consideration of multiple calibration patches. The advantage of the developed method is using local high-pressure zones in calibration patches. The developed method has been successfully applied in calibration of two 5051-350 Tekscan sensors by means of three dead weights: 2 kg, 5 kg and 10 kg. One calibrated sensor was new, and another one had been previously used in the harsh environment of the ice tank in the experiment with model ice. The calibration curves for these two sensors did not reveal a significant difference. For 72% of the 150 obtained load patches in calibration, the absolute discrepancy of actual and calibrated load occurred to be less than 5%.
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