EUV mask and wafer defectivity: strategy and evaluation for full die defect inspection

Bonam, Ravi; Tien, Hung-Yu; Chou, Acer; Meli, Luciana; Halle, Scott; Wu, Ivy; Huang, Xiaoxia; Lei, Chris; Kuan, Chiyan; Wang, Fei; Corliss, Daniel; Fang, Wei; Jau, Jack; Qi, Zhenqing John; Badger, Karen; Turley, Christina; Rankin, Jed

doi:10.1117/12.2219601

Cited by 6 publications

(3 citation statements)

References 5 publications

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“…These defects include soft particles bonded to the surface via van der Waals forces, and hard particles which can be embedded in the substrate and leave a pit when removed [ 100 ]. Various pit smoothing techniques have been devised [ 101 ], however, these methods are limited by the ability to analyse the substrate to identify the defects which must be removed [ 102 , 103 ]. Furthermore, the compound effect of multiple mirrors results in low efficiency, with approximately 1–5% of the photons produced from the UV source interacting with the wafer.…”

Section: Conventional Lithographic Techniquesmentioning

confidence: 99%

Advances in lithographic techniques for precision nanostructure fabrication in biomedical applications

Stokes,

Clark,

Odetade

et al. 2023

Discover Nano

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Nano-fabrication techniques have demonstrated their vital importance in technological innovation. However, low-throughput, high-cost and intrinsic resolution limits pose significant restrictions, it is, therefore, paramount to continue improving existing methods as well as developing new techniques to overcome these challenges. This is particularly applicable within the area of biomedical research, which focuses on sensing, increasingly at the point-of-care, as a way to improve patient outcomes. Within this context, this review focuses on the latest advances in the main emerging patterning methods including the two-photon, stereo, electrohydrodynamic, near-field electrospinning-assisted, magneto, magnetorheological drawing, nanoimprint, capillary force, nanosphere, edge, nano transfer printing and block copolymer lithographic technologies for micro- and nanofabrication. Emerging methods enabling structural and chemical nano fabrication are categorised along with prospective chemical and physical patterning techniques. Established lithographic techniques are briefly outlined and the novel lithographic technologies are compared to these, summarising the specific advantages and shortfalls alongside the current lateral resolution limits and the amenability to mass production, evaluated in terms of process scalability and cost. Particular attention is drawn to the potential breakthrough application areas, predominantly within biomedical studies, laying the platform for the tangible paths towards the adoption of alternative developing lithographic technologies or their combination with the established patterning techniques, which depends on the needs of the end-user including, for instance, tolerance of inherent limits, fidelity and reproducibility.

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Section: Conventional Lithographic Techniquesmentioning

confidence: 99%

Advances in lithographic techniques for precision nanostructure fabrication in biomedical applications

Stokes,

Clark,

Odetade

et al. 2023

Discover Nano

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“…Therefore, a proper mask inspection of defects is necessary to guarantee the throughput required in high volume manufacturing. 4,5 The defects can be sorted as phase or amplitude defects, depending on their effect on the reflected EUV light. Phase defects are usually caused by pits and bumps on the blank substrate or by particles under or inside the multilayer, while amplitude defects are formed during the manufacturing process, commonly on top of the multilayer.…”

Section: Introductionmentioning

confidence: 99%

EUV mask defect material characterization through actinic lensless imaging

Shen

Kazazis

Kim

et al. 2022

Metrology, Inspection, and Process Control XXXVI

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The reflective-mode EUV mask scanning lensless imaging microscope (RESCAN) is a synchrotron-based platform dedicated to EUV mask inspection and review at the Swiss Light Source. It is based on coherent diffraction imaging (CDI), which allows retrieving both the phase and the amplitude information of the mask surface. RESCAN has been successfully tested on masks with programmed phase and amplitude defects. A metrology method that can not only detect defects and contamination, but can also determine the material of the defects, can be a powerful tool to help identify the root cause of the defects. Here, we explore the possibility of leveraging the ability of RESCAN to detect the complex amplitude of the sample to distinguish surface defects of different materials. We fabricated a sample with random logic-like absorber patterns and pillar defects on top of a Mo/Si multilayer. We show our experimental results that show the defects of different materials exhibit specific contrast and phase values. This method can be used not only to detect the masks defects but also to identify the defect materials to a limited extent.

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“…2 In addition, we have demonstrated key aspects of EUV mask infrastructure that provide further confidence in the technology as an HVM solution. 3,4 Nevertheless, the implementation of EUV as part of the integrated patterning process is still a remaining challenge.…”

mentioning

confidence: 99%