Étude de l'alliage Au Cu3

Anquetil, Mathilde

doi:10.1051/jphysrad:01962002302011300

Cited by 25 publications

(3 citation statements)

References 11 publications

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“…A large scatter is observed in the electrical conductivity data of Cu 3 Au which were taken from different sources. [71][72][73][74][75][76][77][78][79] is well-known that the Wiedemann-Franz law holds for pure elements at higher temperatures, 48,54,55) which is given by the following equation;…”

Section: Identification Of Heat Carriermentioning

confidence: 99%

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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Thermal conductivity is one of the key parameters required for high-temperature structural applications of metallic materials. In this overview, the thermal conductivity of intermetallic compounds are extensively described based mainly on our past works, since there had been less works in this research field. Emphasis is placed on the B2 and the L1 2 compounds with metallic bonding such as NiAl, Ni 3 Al, etc., which have been attracting attention for engineering applications at higher temperatures. The thermal conductivity data have been accumulated for the intermetallic compounds, and the phenomenological aspects are reviewed in detail as a function of alloy composition, constituent and temperature. The Wiedemann-Franz law is applicable to the intermetallic compounds, indicating that the carrier of thermal conduction is an electron rather than a phonon. The thermal conductivity of an intermetallic compound with the ordered crystal structure is characterized as an enhancement due to ordering with reference to the basic contribution of solid solution with the disordered crystal structure. It is demonstrated that the thermal conductivity of intermetallic compounds is reduced by the addition of a third element, and this subject is also covered.

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Section: Identification Of Heat Carriermentioning

confidence: 99%

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

et al. 2002

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“…Le montage utilisé pour la mesure des résistances a été décrit ailleurs [3]. Les températures sont connues à mieux que :IL 1 OC, ce qui permet la détermination de p à 1,5 % près.…”

Section: Centre D'études Nucléaires De Saclay Franceunclassified

“…Le temps de relaxation présente un maximum à chaque point de transition ; il augmente à nouveau aux basses températures, ce qui reflète simplement le ralentissement'des phénomènes de diffusion thermique. Ceci est comparable aux observations faites sur Au Cu, [3]. Entre la montée et la descente, les deux courbes sont qualitativement comparables, mais la mise en ordre s'effectue en un temps plus long que la mise en désordre ; de plus elle peut être précédée d'un « temps d'incubation » pouvant aller jusqu'à 60 heures, effet que l'on ne remarque pas dans l'autre sens.…”

Section: Centre D'études Nucléaires De Saclay Franceunclassified

Résistivité électrique d'un alliage Au Cu

Anquetil

1962

J. Phys. Radium

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On the effect of structure on the electrical resistivity of some ordering solid solutions

Varotto

Vidoz

1970

Phys. Stat. Sol. (a)

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An analysis is made of the different contributions to the electrical resistivity of ordering solid solutions. The formalism developed is applied to the process of ordering of Cu,Au alloys. Furthermore, the effect of cold-work upon order in Cu,Au and Ni,Fe is discussed. It is experimentally found that a parameter which depends on the electron thermal scattering term of the resistivity is uniquely related to the state of local order of the structure. Its importance is pointed out as i t permits to separate the effects of order and recovery on the resistivity of these solid solutions. Experimental results and conclusions of previous works are also discussed.Une analyse est faite des diffirentes contributions it la resistivit6 Blectrique des solutions solides avec tendence a l'ordre. La formulation developpee est appliquee au processus d'ordre dans des alliages Cu,Au. E n outre, l'effet d'6crouissage sup l'ordre de cet alliage ainsi que dans Ni,Fe est expliquh. On trouve experimentdement q'un parametre dans la rBsistivit6 qui d6pend de la diffusion thermique des electrons n'est lie qu'8 l'etat d'ordre local de la structure. Son importance est indiquee parce qu'elle permet la separation des effets de l'ordre et de la recuperation sur la ritsistiviti: de ces solutions solides. Des resultats experimentaux et des conclusions des travails precedents sont aussi discutks.

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Étude de l'alliage Au Cu3

Cited by 25 publications

References 11 publications

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

Thermal Conductivity of Intermetallic Compounds with Metallic Bonding

Résistivité électrique d'un alliage Au Cu

On the effect of structure on the electrical resistivity of some ordering solid solutions

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