An analysis is made of the different contributions to the electrical resistivity of ordering solid solutions. The formalism developed is applied to the process of ordering of Cu,Au alloys. Furthermore, the effect of cold-work upon order in Cu,Au and Ni,Fe is discussed. It is experimentally found that a parameter which depends on the electron thermal scattering term of the resistivity is uniquely related to the state of local order of the structure. Its importance is pointed out as i t permits to separate the effects of order and recovery on the resistivity of these solid solutions. Experimental results and conclusions of previous works are also discussed.Une analyse est faite des diffirentes contributions it la resistivit6 Blectrique des solutions solides avec tendence a l'ordre. La formulation developpee est appliquee au processus d'ordre dans des alliages Cu,Au. E n outre, l'effet d'6crouissage sup l'ordre de cet alliage ainsi que dans Ni,Fe est expliquh. On trouve experimentdement q'un parametre dans la rBsistivit6 qui d6pend de la diffusion thermique des electrons n'est lie qu'8 l'etat d'ordre local de la structure. Son importance est indiquee parce qu'elle permet la separation des effets de l'ordre et de la recuperation sur la ritsistiviti: de ces solutions solides. Des resultats experimentaux et des conclusions des travails precedents sont aussi discutks.
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