2008
DOI: 10.1007/978-1-4020-8301-3
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ESD Protection Device and Circuit Design for Advanced CMOS Technologies

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Cited by 67 publications
(42 citation statements)
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“…Complex ICs increasingly become susceptible to these failures owing to the scaling of technologies. Under the scaling regime, horizontal and vertical features are reduced in size which results in increasingly susceptibility to ESD/EOS failures [2]. These failures are caused by excessive electric field and/or excessive current densities and failure mechanisms include dielectric breakdown, electro-migration of metal lines and contacts [2].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Complex ICs increasingly become susceptible to these failures owing to the scaling of technologies. Under the scaling regime, horizontal and vertical features are reduced in size which results in increasingly susceptibility to ESD/EOS failures [2]. These failures are caused by excessive electric field and/or excessive current densities and failure mechanisms include dielectric breakdown, electro-migration of metal lines and contacts [2].…”
Section: Introductionmentioning
confidence: 99%
“…Under the scaling regime, horizontal and vertical features are reduced in size which results in increasingly susceptibility to ESD/EOS failures [2]. These failures are caused by excessive electric field and/or excessive current densities and failure mechanisms include dielectric breakdown, electro-migration of metal lines and contacts [2]. ESD protection circuits consisting of I/O protection, and clamps are routinely used in ICs to protect them against ESD/EOS damages.…”
Section: Introductionmentioning
confidence: 99%
“…However, the GGNMOS needs a relatively large silicon area due to the low current passing capability. Therefore, significant parasitic effects are present, which makes GGNMOS devices the non-optimum solution for high-ESD robustness, high frequency, large pin count, and area-sensitive IC chips [2,3].…”
Section: Introductionmentioning
confidence: 99%
“…MOSFETs are widely used in switching devices, output drivers, and general ESD protection in high voltage ICs. However, when MOSFETs or MOSFET based devices are used as ESD protection devices, it has been found that MOSFETs are inherently weak with respect to ESD robustness and ESD reliability [2]. In addition, MOSFET based ESD protection devices consume a relatively large silicon area and latch-ups caused by static or transients may occur due to their relatively low holding voltage.…”
Section: Introductionmentioning
confidence: 99%