Epoxy Adhesive as Die Attach Material in Semiconductor Packaging: A Review

Arifin, Muhammad Syamsul; Wivanius, Nadhrah; Prebianto, Nanta Fakih

doi:10.1109/incae.2018.8579410

Cited by 5 publications

(4 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Common die attach materials are polymer-based nanocomposites, which often employ Ag and SiO 2 as fillers and epoxy, polyimide, acrylate and silicone as matrixes [62]. Silver pastes consisting of silver fillers and epoxy resins can be thermally cured to attach the chips [63]. However, high cost of Ag sets economic barriers for commercialisation.…”

Section: Die Attach Materialsmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

View full text Add to dashboard Cite

Semiconductor packaging materials play a critical role in the development of semiconductor devices. They not only provide reliable protection and support, but also contribute to the electrical connection between the chip and the external circuit. Among many choices of packaging materials, polymer‐based nanocomposites have become the mainstream candidate due to their low cost, easy processability, and tunable properties. Materials with low dielectric constant and dielectric loss, high glass transition temperature, fast thermal conductivity, suitable coefficient of thermal expansion, low viscosity, and good processability are commonly required in semiconductor packaging, yet most polymers do not meet these criteria. Therefore, modulation of the polymer matrix, introduction of suitable fillers, and modification of the filler surface are often effective approaches to enhance the performance of the composites. Here, the authors first review current research progresses of polymer‐based nanocomposites for five different types of packaging applications, namely moulding compounds, thermal interface materials, underfills, die attach materials, and substrates. The authors then present prospects of developing next‐generation polymer‐based nanocomposites for advanced semiconductor packaging and propose some suggestions to solve the existing challenges.

show abstract

Section: Die Attach Materialsmentioning

confidence: 99%

Polymer‐based nanocomposites in semiconductor packaging

Sun

2023

IET Nanodielectrics

View full text Add to dashboard Cite

show abstract

“…2,3 Epoxy is a well-known polymer in the electronics industry, and it is widely used in electrically conductive adhesives, integrated circuits, printed circuit boards, and semiconductors. 4,5 Due to its brittle behavior, poor thermal and electrical properties, epoxy resin presents several challenges when employed in various high-performance applications. 6 The demands for multifunctional epoxy-based resins have been extensively increased due to the rapid progress in the electronics industry and significant efforts to produce smaller, faster, and more powerful electronic devices.…”

Section: Introductionmentioning

confidence: 99%

The effect of low-concentration graphene aerogel on the multifunctional properties of epoxy resin

Mahdavi

Adibnazari

2023

Proceedings of the Institution of Mechanical Engineers, Part L:

View full text Add to dashboard Cite

In this study, graphene aerogel (GA) was used to improve the multifunctionality of epoxy resin, which is essential for its application in integrated circuits and semiconductors. To this end, a scalable method with a high capacity for producing large-size GA with desirable quality was proposed for GA synthesis. The synthesized GA was utilized to produce epoxy nanocomposites by infiltrating epoxy resin into its macro-pores. The flexural modulus of the GA/epoxy nanocomposite was investigated experimentally, and the results indicated a 30% increase with respect to the pure epoxy. The electrical conductivity of the nanocomposite reached an exceptional value of 0.7 S/m, which is 13 orders of magnitude greater than the electrical conductivity of pure epoxy. Moreover, the measured thermal conductivity for pure epoxy and GA/epoxy nanocomposites were 0.23 and 0.40 W/mK, respectively. The percentage of thermal conductivity improvement per filler content was over 101, among the highest values attained by different filler types in polymer nanocomposites. This study demonstrates that the proposed method can simultaneously increase epoxy polymers’ mechanical, electrical, and thermal properties with a low nanomaterial concentration, which could greatly benefit applications requiring highly multifunctional epoxy polymers.

show abstract

“…Epoxy resins are known as adjustable resins that could be utilized in various applications, from adhesives in different industries, to highly complicated aerospace structural parts [1,2]. In electronics industry, epoxy is a known polymer, and it is broadly utilized in electrically conductive adhesives, integrated circuits, printed circuit boards and semiconductors [3,4]. In many high-performance applications, the use of epoxy resin is encountered with some challenges due to its brittle behavior, poor thermal and electrical properties [5].…”

Section: Introductionmentioning

confidence: 99%

“…where 𝜌 𝑓 is the GA density, and 𝜌 𝐺 is graphite density which is 2.2 g/cm 3 . With simple calculation, it could be found that the porosity of the prepared foam is around 99.63% which is remarkable value for a porous material.…”

mentioning

confidence: 99%

Excellent multifunctional behaviors of epoxy nanocomposites reinforced with graphene aerogel

Mahdavi

Adibnazari

2022

Preprint

View full text Add to dashboard Cite

In this study, graphene aerogel (GA) was utilized to improve the multifunctionality of epoxy resin, which is highly necessary in its applications in integrated circuits and semiconductors. A scalable method with high capability for production of large size GA with desirable quality was proposed for GA synthesis. The synthesized GA was utilized to produce epoxy nanocomposite by epoxy resin infiltration in its macro-pores. Flexural modulus of the GA/epoxy nanocomposite was experimentally investigated and the results showed 30% increase with respect to the pure epoxy. The electrical conductivity of the nanocomposite reached to remarkable amount of 0.7 S/m, which is 13 orders of magnitudes more than the electrical conductivity of the neat epoxy. Moreover, the measured thermal conductivity for pure epoxy and GA/epoxy nanocomposites were 0.23 and 0.40 W/mK, respectively. The percentage of thermal conductivity enhancement per filler content is more than 101, which is in the top range of the reached values by various filler types in polymer nanocomposites. The proposed method could simultaneously increase the mechanical, electrical and thermal properties of epoxy polymer, and could be greatly beneficial for applications that need epoxy polymer with high multifunctionality.

show abstract

Epoxy Adhesive as Die Attach Material in Semiconductor Packaging: A Review

Cited by 5 publications

References 20 publications

Polymer‐based nanocomposites in semiconductor packaging

Polymer‐based nanocomposites in semiconductor packaging

The effect of low-concentration graphene aerogel on the multifunctional properties of epoxy resin

Excellent multifunctional behaviors of epoxy nanocomposites reinforced with graphene aerogel

Contact Info

Product

Resources

About