1999
DOI: 10.1063/1.369778
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Epitaxial growth of stoichiometric (100) GaAs at 75 °C

Abstract: Molecular beam epitaxial growth of InAs/AlGaAsSb deep quantum well structures on GaAs substratesSurface evolution on vicinal GaAs(001) surfaces in the transition range from two-dimensional to step-flow growth Stoichiometric single crystal GaAs is grown at 75°C by a migration-enhanced-epitaxy ͑MEE͒ technique. The stoichiometry of the GaAs films can be controlled by adjusting the arsenic monolayer deposition time. For Ga-rich compositions, epitaxy breaks down and polycrystalline GaAs results. For stoichiometric … Show more

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Cited by 7 publications
(1 citation statement)
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“…The wafers were slowly outgassed up to 450 K and then heated from 450 to 825 K under an As 4 overpressure so as to obtain a naturally self-limiting 28 atomic monolayer of arsenic on the silicon surface ͑''arsenic passivation''͒ after the protective hydrogen-passivation layer desorbs at roughly 800 K. 27 The arsenic-passivated wafer was then cooled and 1 h was allowed for steady-state temperature to be established. Stoichiometric GaAs was deposited at 348 K to a thickness of h m by a migration-enhanced epitaxy ͑MEE͒ technique; 29 the slow average deposition rate ͑MEE͒ of approximately 0.015 nm/s, contributes to the retention of epitaxy at such a low growth temperature. The monolithic thickness, h m , for the GaAs/Si case is empirically observed and can be calculated to be 80 nm using a morphology-conversion analysis.…”
Section: Experimental Techniquesmentioning
confidence: 99%
“…The wafers were slowly outgassed up to 450 K and then heated from 450 to 825 K under an As 4 overpressure so as to obtain a naturally self-limiting 28 atomic monolayer of arsenic on the silicon surface ͑''arsenic passivation''͒ after the protective hydrogen-passivation layer desorbs at roughly 800 K. 27 The arsenic-passivated wafer was then cooled and 1 h was allowed for steady-state temperature to be established. Stoichiometric GaAs was deposited at 348 K to a thickness of h m by a migration-enhanced epitaxy ͑MEE͒ technique; 29 the slow average deposition rate ͑MEE͒ of approximately 0.015 nm/s, contributes to the retention of epitaxy at such a low growth temperature. The monolithic thickness, h m , for the GaAs/Si case is empirically observed and can be calculated to be 80 nm using a morphology-conversion analysis.…”
Section: Experimental Techniquesmentioning
confidence: 99%