2022
DOI: 10.1007/s10853-021-06817-x
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Enhanced thermal conductivity and long-term stability of diamond/aluminum composites using SiC-coated diamond particles

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Cited by 9 publications
(6 citation statements)
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“…The 3DGN/Al composites with lower densification than that of pure aluminum are one of the reasons for the higher I corr [49]. The porosity and crevices between the interface of aluminum matrix and 3DGN reinforcement are favorable sites for pitting of metals in AMCs and accelerating the dissolution of aluminum matrix [50]. Furthermore, aluminum oxide is very dense, which can prevent further corrosion.…”
Section: Discussionmentioning
confidence: 99%
“…The 3DGN/Al composites with lower densification than that of pure aluminum are one of the reasons for the higher I corr [49]. The porosity and crevices between the interface of aluminum matrix and 3DGN reinforcement are favorable sites for pitting of metals in AMCs and accelerating the dissolution of aluminum matrix [50]. Furthermore, aluminum oxide is very dense, which can prevent further corrosion.…”
Section: Discussionmentioning
confidence: 99%
“…The diamond with the CTE of 1.0~3.0 × 10 −6 /K [8] composited to the Al matrix to perfectly match the CTE of the chip. Diamond/Al composites emerge as promising candidates for advanced thermal management due to their matching CTE, superior TC, and low density [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…However, the significant disparity in the physical and chemical characteristics between diamond particles and the Al matrix poses a challenge, leading to interface incompatibility that significantly reduces the TC of diamond/Al composite [11,12]. Furthermore, in conventional preparation methods (such as powder metallurgy [13], gas pressure infiltration [9], vacuum pressure infiltration [14], vacuum hot pressing [15], and spark plasma sintering [16]), the interface of the two phases inevitably produces Al 4 C 3 under high-temperature or long-term contact conditions [9,[13][14][15][16]. The presence of Al 4 C 3 at the interface not only significantly decreases the TC of the composite [17] but also restricts its application due to the hydrolytic nature of Al 4 C 3 [9,18].…”
Section: Introductionmentioning
confidence: 99%
“…Currently, the most ideal heat sink material is single-crystal diamond, but it is difficult to manufacture, limited in size, and costly. Therefore, other diamond composites are used, such as diamond/copper and diamond/aluminum [ 4 , 5 ]. However, the presence of thermal shocks may cause the diamond/metal interface to separate and thus reduce the heat dissipation effect.…”
Section: Introductionmentioning
confidence: 99%