“…For this imitation, memory devices with high density, high performance, and low-power operation are required. Several metal–oxide active channel materials, such as SiO x , ZrO 2 , TiO x , Hf x O, and Y 2 O 3 , have been considered for RRAM device fabrication [ 3 , 4 , 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 ]. Y 2 O 3 is characterized by a high dielectric constant, large optical bandgap, and fast internal ion transport and is therefore considered quite attractive for use in such devices.…”