Enhanced immersion cooling using two-tier micro- and nano-structures

Hsu, Ya Tzu; Li, Jia Xiong; Lu, Ming-Chang

doi:10.1016/j.applthermaleng.2017.12.067

Cited by 22 publications

(4 citation statements)

References 27 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…These functionalized surfaces had high roughness values and provided an abundance of active nucleation sites, which helped increase the HTC and the CHF by 600% and 55%, respectively. Hsu et al [72] studied the enhancement of pool boiling of Novec™ 649 using silicon nanowire/nanopillar one-and two-tier structures. The highest CHF of 235 kW m −2 was recorded alongside a maximal HTC of 23.6 kW m −2 K −1 .…”

Section: Boiling Heat Transfer With Dielectric Fluidsmentioning

confidence: 99%

Hydrophilic and Hydrophobic Nanostructured Copper Surfaces for Efficient Pool Boiling Heat Transfer with Water, Water/Butanol Mixtures and Novec 649

et al. 2021

View full text Add to dashboard Cite

Increasing heat dissipation requirements of small and miniature devices demands advanced cooling methods, such as application of immersion cooling via boiling heat transfer. In this study, functionalized copper surfaces for enhanced heat transfer are developed and evaluated. Samples are functionalized using a chemical oxidation treatment with subsequent hydrophobization of selected surfaces with a fluorinated silane. Pool boiling tests with water, water/1-butanol mixture with self-rewetting properties and a novel dielectric fluid with low GWP (Novec™ 649) are conducted to evaluate the boiling performance of individual surfaces. The results show that hydrophobized functionalized surfaces covered by microcavities with diameters between 40 nm and 2 µm exhibit increased heat transfer coefficient (HTC; enhancements up to 120%) and critical heat flux (CHF; enhancements up to 64%) values in comparison with the untreated reference surface, complemented by favorable fabrication repeatability. Positive surface stability is observed in contact with water, while both the self-rewetting fluids and Novec™ 649 gradually degrade the boiling performance and in some cases also the surface itself. The use of water/1-butanol mixtures in particular results in surface chemistry and morphology changes, as observed using SEM imaging and Raman spectroscopy. This seems to be neglected in the available literature and should be focused on in further studies.

show abstract

Section: Boiling Heat Transfer With Dielectric Fluidsmentioning

confidence: 99%

Hydrophilic and Hydrophobic Nanostructured Copper Surfaces for Efficient Pool Boiling Heat Transfer with Water, Water/Butanol Mixtures and Novec 649

et al. 2021

View full text Add to dashboard Cite

show abstract

“…Further performance-enhancing ideas using heat spreaders [222], ethanol phase-change coolant [223], and nanofluid [224] have been reported in literature. Hsu et al [225] applied three array structures (Si nanowire (SiNW), Si micropillar (SiMP), and Si nanowires on a Si micropillar (SiNW/MP)) to improve the cooling performance of Novec 649. They reported SiNW/MP is the most effective surface for immersion cooling with CHF and HTC enhancement of 30% and 455%, respectively, compared to plain SiO2 surface.…”

Section: Immersion Coolingmentioning

confidence: 99%

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Rahman,

Moghassemi,

Arsalan

et al. 2024

IEEE Access

View full text Add to dashboard Cite

Recently, the thermal management of power electronic converters has gained significant attention due to the continuous trend of developing very compact power electronic converters with high power density. With the evolution of power semiconductor devices, high operating temperatures and large thermal cycles have become possible, necessitating a significant improvement in thermal system designs. Researchers have made significant efforts to develop effective thermal management systems for improving the reliability and lifetime of power electronic converters. This article intends to present a thorough review of thermal management systems employed in power electronics cooling. The applied thermal management techniques have been reviewed from the perspective of electrical parameter regulation and heat dissipation control. Regulation of electrical parameters involves active thermal control, which is a method for controlling junction temperature and thermal cycling of power semiconductor devices. The active thermal control implementation processes reviewed in this article consist of increasing overload capacity, manipulating switching and conduction losses, employing modified modulation process, balancing thermal stress at the converter level, and controlling thermal stress at the system level. Control of heat dissipation can be achieved through direct and indirect cooling of power electronic converters with air or liquid as the coolant. The effectiveness and implementation methods of these cooling techniques, such as channel cooling, phase change material-based cooling, immersion cooling, jet impingement and spray cooling, are reviewed in this paper. Moreover, performance-enhancing ideas and challenges for these techniques are discussed. The primary objective of this review paper is to bridge the existing gap in the literature by offering a comprehensive comparison of commonly employed thermal management techniques. INDEX TERMSActive thermal control (ATC), Power semiconductor device (PSD), Microchannel, Spray cooling, Jet impingement, Immersion cooling, Phase change material (PCM), and Active cooling.

show abstract

“…that influence CHF and BHTC. There are several techniques to modify these properties like porous coating [7,12,19,26,33,45,47,52,55,65,67,74], nanotexture [14,27,28,38,40,44,50,73], nanowire [34,35,49,58,59,70,71], microstructures [69], microchannels [20,21,25,51,60,63], pin-fin [22,32,54], nanoparticle deposition [1-3, 8, 18, 53] etc.…”

Section: Introductionmentioning

confidence: 99%

Pool Boiling Heat Transfer on a Micro‐Structured Copper Oxide Surface with Varying Wettability

et al. 2022

View full text Add to dashboard Cite

Copper surface is modified to copper oxide surface for high heat flux electronics applications. Copper oxide surface is prepared by chemical etching using NaOH and (NH 4 ) 2 S 2 O 8 . A pool boiling experiment is conducted to investigate the critical heat flux (CHF) and boiling heat transfer coefficient (BHTC). The results indicate that BHTC of all copper oxide surfaces are enhanced remarkably. Bubble dynamics are also analyzed by means of a high-speed camera. Bubble visualization demonstrates that the active nucleation sites for the copper oxide surfaces are higher than the bare copper surface.

show abstract

Enhanced immersion cooling using two-tier micro- and nano-structures

Cited by 22 publications

References 27 publications

Hydrophilic and Hydrophobic Nanostructured Copper Surfaces for Efficient Pool Boiling Heat Transfer with Water, Water/Butanol Mixtures and Novec 649

Hydrophilic and Hydrophobic Nanostructured Copper Surfaces for Efficient Pool Boiling Heat Transfer with Water, Water/Butanol Mixtures and Novec 649

Emerging Trends and Challenges in Thermal Management of Power Electronic Converters: A State of the Art Review

Pool Boiling Heat Transfer on a Micro‐Structured Copper Oxide Surface with Varying Wettability

Contact Info

Product

Resources

About