2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) 2017
DOI: 10.1109/asmc.2017.7969274
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Enabling low temperature metal nitride ALD using ultra-high purity hydrazine: ET/ID: Enabling technologies and innovative devices

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Cited by 4 publications
(6 citation statements)
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“…One is a trend toward bulk synthesis without control of μ(N) using pressure. Given the importance of μ(N) in controlling nitride formation, various approaches are gaining traction in basic research, such as the use of reactive fluxes and metathesis [e.g., carbodiimides (162,163) and amides (164)], as well as the use of reactive gases outside traditional thin-film deposition chambers [e.g., N 2 H 4 -based atomic layer deposition (165) or N 2 -based plasma (12,166)]. Another is the specific selection of substrates in order to stabilize metastable phases during deposition, an exciting possibility given the opportunities for heteroepitaxial integration discussed above.…”
Section: Challenges and Promise In Ternary Nitride Synthesismentioning
confidence: 99%
“…One is a trend toward bulk synthesis without control of μ(N) using pressure. Given the importance of μ(N) in controlling nitride formation, various approaches are gaining traction in basic research, such as the use of reactive fluxes and metathesis [e.g., carbodiimides (162,163) and amides (164)], as well as the use of reactive gases outside traditional thin-film deposition chambers [e.g., N 2 H 4 -based atomic layer deposition (165) or N 2 -based plasma (12,166)]. Another is the specific selection of substrates in order to stabilize metastable phases during deposition, an exciting possibility given the opportunities for heteroepitaxial integration discussed above.…”
Section: Challenges and Promise In Ternary Nitride Synthesismentioning
confidence: 99%
“…The molecular structure of N2H4 is as shown in Figure 1 using a ball-stick model. Safety was a key concern while handling N2H4, but the newly available ultrahigh purity anhydrous N2H4 source is compliant with the safety standard requirements and has also demonstrated the deposition of metal nitrides at low temperatures [10][11][12]. Abdulagatov et al recently demonstrated AlN deposition by thermal ALD using tris(diethylamido)aluminum (III) (TDEAA) and hydrazine in the deposition temperature range from 150 to 280 °C [13].…”
Section: Introductionmentioning
confidence: 99%
“…The molecular structure of N 2 H 4 is as shown in Figure 1 using a ball-stick model. Safety was a key concern while handling N 2 H 4 , but the newly available ultra-high purity anhydrous N 2 H 4 source is compliant with the safety standard requirements and has also demonstrated the deposition of metal nitrides at low temperatures [ 10 , 11 , 12 ].…”
Section: Introductionmentioning
confidence: 99%
“…Where there are challenges, there is also opportunity, and we therefore highlight some developing fields for ternary nitride synthesis. The first is a trend toward bulk synthesis without control of µ(N) using pressure: given the importance of µ(N) in controlling nitride formation, various approaches are gaining traction in basic research, such as the use of reactive fluxes and metathesis (e.g., carbodiimides (161,162) and amides ( 163)), as well as the use of reactive gases outside of traditional thin-film deposition chambers (e.g., N 2 H 4based atomic layer deposition (164) or N 2 -based plasma (12,165)). Another is the specific selection of substrates in order to stabilize metastable phases during deposition, an exciting possibility given the opportunities for heteroepitaxial integration discussed above.…”
Section: Challenges and Promise In Ternary Nitride Synthesismentioning
confidence: 99%