A technique to efficiently reduce differential-to-common mode conversion occuring at a bend discontinuity in coupled microstrip lines is investigated. Total signal integrity in the interconnect structure has been improved by minimizing the differential reflection coefficient and insertion loss simultaneously. This is achieved by changing the geometry of the microstrip lines via a tapering section to tightly or very tightly coupled ones in the area of the bend. The new design was manufactured, measured, and validated by means of time-domain analysis, providing very satisfactory results.
IntroductionDifferential signaling is a popular way to transmit signals across circuit boards because of its high electromagnetic immunity against conducted and radiated interfering signals [1]. However, when applied, it is important to keep the differentialto-common mode conversion level low, as this phenomenon has a strong influence on the signal integrity [1][2][3][4][5]. The emergence of new technologies, leading to high bit rates, short rise times and small noise margins, makes this requirement even more stringent. Unfortunately, conversion easily occurs, due to signal trace length mismatch [6] or asymmetric discontinuities in the circuit layout, and in particular at a bend of coupled microstrip lines [2,4, 5]. A reduction of the unwanted common-mode noise can be obtained by applying filtering structures [4, 5] or by adding extra compensating capacitance [2].In [5], a new approach was presented to reduce conversion noise caused by a bend discontinuity over a large frequency range (from DC to 6 GHz), while maintaining low reflection and insertion loss. Whereas in [5] the focus was on frequencydomain S-parameters simulations and circuit modeling, here, we investigate the behavior of improved bends in time domain by means of measurements. Such time domain analysis provides valuable signal integrity related data for circuit designers.