2017
DOI: 10.24295/cpsstpea.2017.00016
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Emerging Trends in Silicon Carbide Power Electronics Design

Abstract: Abstract-The emergence of wide bandgap power semiconductor devices has opened the possibilities of improved electrical performance and power density. Advanced research into wide bandgap power electronics also includes advances in integrated circuit design, semiconductor device modeling, 3D electronic packaging, and computer-aided design of wide bandgap based electronics. These emerging trends are described along with some early results indicating the additional improvements possible in power density. Operation… Show more

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Cited by 25 publications
(7 citation statements)
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“…However, there also exists examples of machine designs that can tolerate high dV /dt without suffering increased problems with partial discharges [103]. Therefore, in line with the recent trends, multi-physical design tools are needed for PECs for future industry advancements [104]- [106], where the machine design objectives are included [107].…”
Section: Prospects and Challenges Of Ongoing Pec Developments For mentioning
confidence: 99%
“…However, there also exists examples of machine designs that can tolerate high dV /dt without suffering increased problems with partial discharges [103]. Therefore, in line with the recent trends, multi-physical design tools are needed for PECs for future industry advancements [104]- [106], where the machine design objectives are included [107].…”
Section: Prospects and Challenges Of Ongoing Pec Developments For mentioning
confidence: 99%
“…These intuitive practices are good, but there are no design rules codifying these practices. Since the power module physical design process is automated [2], [20], PD rules need to be accounted for in module design automation. This work is a step toward providing a methodology or approach to account for PD systematically in the design automation of power modules.…”
Section: Introductionmentioning
confidence: 99%
“…Most commercial SiC power modules are currently packaged using traditional wire bonding. One reason for this could be that the conventional packaging method has already passed a strict power cycle test (20 million cycles without failures) and is certified with the JEDEC standards [36,37]. Another reason is that conventional packaging can be performed using existing processing equipment, requiring no additional investment in equipment development.…”
Section: Introductionmentioning
confidence: 99%