“…The explosive growth of consumer wireless markets has led to decreases in the size and weight of wireless systems, particularly hand-held communication systems; simultaneously, the performance has been improved, cost has been reduced, and functionality has been added. 1,2) However, in comparison to the rapidly integrated active devices described by Moore's law, even the scaled-down version of the off-chip passive components with a case size of 0201 still occupy an increasingly large area on circuit boards with less contribution to the reduction of the number of constituent chip components; this is a major obstacle to the miniaturization and integration of state-of-the-art wireless systems. 3,4) Recently, low-temperature cofired ceramics (LTCC) that are capable of containing buried and surfacelayer integrated passives, highly conductive materials, and few solder joints have been considered as a good candidate for the fabrication of small, low-cost RF modules for wireless applications, such as the Bluetooth modules that have already been commercialized by many companies.…”