Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities

Cui, Ying; Li, Man; Hu, Yongjie

doi:10.1039/c9tc05415d

Cited by 117 publications

(74 citation statements)

References 155 publications

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“…For example, polymers and polymer composites, and epoxy composites in particular, are widely used in electronics to build not only packaging, substrates, boards, and sealing materials but also crucial components such as thermal interface materials (TIM) due to their lightness, flexibility, easy processing, excellent chemical stability, and durability [21]. To improve heat dissipation of polymers, the common strategy is to increase their thermal conductivity by adding conductive nanofillers [20,21,23]. An alternative or complementary strategy could be to introduce PCMs as a functional filler in order to increase the total absorbed heat and simultaneously keep the temperature in the safety range.…”

Section: Introductionmentioning

confidence: 99%

Polydopamine-Coated Paraffin Microcapsules as a Multifunctional Filler Enhancing Thermal and Mechanical Performance of a Flexible Epoxy Resin

et al. 2020

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This work focuses on flexible epoxy (EP) composites containing various amounts of neat and polydopamine (PDA)-coated paraffin microcapsules as a phase change material (PCM), which have potential applications as adhesives or flexible interfaces with thermal management capability for electronics or other high-value-added fields. After PDA modification, the surface of PDA-coated capsules (MC-PDA) becomes rough with a globular appearance, and the PDA layer enhances the adhesion with the surrounding epoxy matrix, as shown by scanning electron microscopy. PDA deposition parameters have been successfully tuned to obtain a PDA layer with a thickness of 53 ± 8 nm, and the total PDA mass in MC-PDA is only 2.2 wt %, considerably lower than previous results. This accounts for the fact that the phase change enthalpy of MC-PDA is only marginally lower than that of neat microcapsules (MC), being 221.1 J/g and 227.7 J/g, respectively. Differential scanning calorimetry shows that the phase change enthalpy of the prepared composites increases with the capsule content (up to 87.8 J/g) and that the enthalpy of the composites containing MC-PDA is comparable to that of the composites with MC. Dynamic mechanical analysis evidences a decreasing step in the storage modulus of all composites at the glass transition of the EP phase, but no additional signals are detected at the PCM melting. PCM addition positively contributes to the storage modulus both at room temperature and above Tg of the EP phase, and this effect is more evident for composites containing MC-PDA. As the capsule content increases, the mechanical properties of the host EP matrix also increase in terms of elastic modulus (up to +195%), tensile strength (up to +42%), Shore D hardness (up to +36%), and creep compliance (down to −54% at 60 min). These effects are more evident for composites containing MC-PDA due to the enhanced interfacial adhesion.

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Section: Introductionmentioning

confidence: 99%

Polydopamine-Coated Paraffin Microcapsules as a Multifunctional Filler Enhancing Thermal and Mechanical Performance of a Flexible Epoxy Resin

et al. 2020

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“…1b . Fundamentally, there is trade-off between high thermal conductivity and soft mechanics 15 , 16 . Strongly bonded materials such as ceramics and dielectrics usually give high κ 17 , however, their rigid structures can potentially lead to performance degradation like mechanical pump-out, delamination, cracking, and void formation.…”

Section: Resultsmentioning

confidence: 99%

“…Nanostructures such as carbon nanotubes and metal nanowires have been applied to make compromise and improve the mechanical compliance 20 – 23 . Adhesives and gels possess good mechanical compliance, but usually exhibit a low thermal conductivity; their mixtures have been studied to make improvement over poor interfaces and weak van der Waals bonding 16 , 24 – 26 . Despite many exciting progresses (Fig.…”

Section: Resultsmentioning

confidence: 99%

Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

et al. 2021

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Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics.

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“…In the United States, the construction of industry accounts for about 41% of primary energy consumption, of which 37% is spent on the indoor thermal environment of the building, which further intensifies the energy crisis and global warming. [ 2,3 ]…”

Section: Introductionmentioning

confidence: 99%

Superabsorbent Fabric Based on Weft‐Back Weave Structure for Efficient Evaporative Cooling

Javed

Luo

et al. 2020

Adv Materials Inter

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Fabrics with efficient evaporative cooling performance not only improve personal thermal comfort but also show essential significance in energy‐saving. This study reports an integrated cooling fabric based on the weft‐back weave structure. By adjusting the type of warp and weft yarns, water absorbency and wettability of the fabric can be altered to achieve the regulation of the fabric's performance. The prepared single‐sided superabsorbent cooling fabric (S‐SAF) shows a water absorbency of 370% and a water retention time of 90 min. S‐SAF can efficiently reduce the indoor temperature of a simulated building by about 6 °C under the radiation of 200 W m−2, and the cooling time is extended up to 150 min. Meanwhile, S‐SAF shows excellent evaporative cooling for the human body and exhibits good recyclability. Therefore, the prepared cooling fabric achieves thermal comfort under a hot and dry environment and has broad application prospects in person and building cooling.

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Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities

Abstract: State-of-the-art experiments and modeling, challenges, and future opportunities for developing high-performance interface materials for electronics thermal management.

Cited by 117 publications

References 155 publications

Polydopamine-Coated Paraffin Microcapsules as a Multifunctional Filler Enhancing Thermal and Mechanical Performance of a Flexible Epoxy Resin

Polydopamine-Coated Paraffin Microcapsules as a Multifunctional Filler Enhancing Thermal and Mechanical Performance of a Flexible Epoxy Resin

Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Superabsorbent Fabric Based on Weft‐Back Weave Structure for Efficient Evaporative Cooling

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