Electrothermoelastic modeling of MEMS gripper

Mayyas, Mohammad; Stephanou, H.E.

doi:10.1007/s00542-008-0752-7

Cited by 13 publications

(11 citation statements)

References 16 publications

(29 reference statements)

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“…A class of new active end-effectors based on an E-T actuation principle was introduced in our earlier work [7,11]. The performance of E-T actuators is limited by the maximum operating temperature and thermal stresses [12][13][14].…”

Section: Open Accessmentioning

confidence: 99%

“…They can be fabricated from different materials using various technologies including Silicon on Insulator, SU8, and MUMPs [7]. The multi physics simulation of thermal MEMS actuators is often obtained from Finite Element Modeling (FEM) or Finite Element Approximation (FEA).…”

Section: Open Accessmentioning

confidence: 99%

“…asymmetrical thermal expansion has popularly been applied to generate both the large force and deflection using structures such as bent beam and folded beam actuators [1][2][3][4][5][6][7][8].…”

Section: Open Accessmentioning

confidence: 99%

“…In general, the temperature variation (T) along a microstructure (x) is governed by a nonlinear one dimensional Partial Differential Equation (PDE) with an input energy source from current (I) whose density along microbeam is (J = I/wh) [6,7,13]. A suspended rectangular bar with width w and height (h) is kept at a fixed air gap distance relative to the substrate.…”

Section: Steady-state Thermal Modelingmentioning

confidence: 99%

“…A suspended rectangular bar with width w and height (h) is kept at a fixed air gap distance relative to the substrate. The rate of heat change per unit area is equal to the heat production per unit volume (A.dx) per time minus heat losses, or [7] (1) …”

Section: Steady-state Thermal Modelingmentioning

confidence: 99%

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Comprehensive Thermal Modeling of ElectroThermoElastic Microstructures

Mayyas

2012

Actuators

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Bent and folded beam configurations have been popularly used in electrothermoelastic (E-T) actuation. This paper introduces new designs of thermal end-effector with micro-grasping and micro-heating capabilities. We obtained analytical models for all possible steady state temperature responses of suspended and overhanging microstructures that constitute bent beam, folded beam, and combined actuators. Generally, the thermal response of E-T microstructures is sensitive to the boundary conditions, particularly for high power input. Thermal models have predicted the failure due to melting, which is the most common reason for failure of E-T devices, and it often occurs in the longest and the thinnest microstructure.

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