2009
DOI: 10.1016/j.jcrysgro.2009.01.049
|View full text |Cite
|
Sign up to set email alerts
|

Electron microscopy analysis of dislocation behavior in HVPE-AlGaN layer grown on a stripe-patterned (0001) sapphire substrate

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
2

Citation Types

0
4
0

Year Published

2010
2010
2017
2017

Publication Types

Select...
7

Relationship

1
6

Authors

Journals

citations
Cited by 8 publications
(4 citation statements)
references
References 4 publications
(4 reference statements)
0
4
0
Order By: Relevance
“…5(b). 18) The Al 0:06 Ga 0:94 N/GaN SLS is more effective to block screw type of dislocations than that of edge type of dislocations as penetration of most of the screw dislocation lines are blocked at the ML/SLS interface and lower region of the SLS layer, compared to that of edge dislocations which exceeds into the middle and upper region of the SLS layer before inclination. Threading dislocation density (TDD) along the upper edge of the Al 0:06 Ga 0:94 N/GaN SLS cladding layer is estimated to be 3:4 Â 10 9 for screw and mixed component of TD under g ¼ ð0002Þ diffraction condition, and 6:5 Â 10 9 for edge and mixed component of TD under g ¼ ð11…”
Section: Resultsmentioning
confidence: 99%
“…5(b). 18) The Al 0:06 Ga 0:94 N/GaN SLS is more effective to block screw type of dislocations than that of edge type of dislocations as penetration of most of the screw dislocation lines are blocked at the ML/SLS interface and lower region of the SLS layer, compared to that of edge dislocations which exceeds into the middle and upper region of the SLS layer before inclination. Threading dislocation density (TDD) along the upper edge of the Al 0:06 Ga 0:94 N/GaN SLS cladding layer is estimated to be 3:4 Â 10 9 for screw and mixed component of TD under g ¼ ð0002Þ diffraction condition, and 6:5 Â 10 9 for edge and mixed component of TD under g ¼ ð11…”
Section: Resultsmentioning
confidence: 99%
“…Then the paired TDs bend to come close to each other with the growth of thin film and are finally merged to be annihilated. The bending mechanism was discussed by Speck's research group [5,6] as well as the present authors' research group [7,8]. As shown in Fig.…”
Section: Resultsmentioning
confidence: 71%
“…They also investigated the effect of the total pressure, V/III ratio, and substrate miscut direction on the growth of AlGaN on a trench-shaped PSS [ 11 , 12 ]. Kuwano et al showed that the main problem in ELOG is predominantly caused by the grain growth along different orientations on the sidewalls of the patterned substrates [ 13 ]. Richter et al discussed the growth behavior of an Al 0.3 Ga 0.7 N layer grown on a honeycomb-shaped PSS [ 14 ].…”
Section: Introductionmentioning
confidence: 99%