Abstract:Cross‐sectional transmission electron microscope (TEM) observation was performed in detail to analyze the morphology of threading dislocations (TDs) in GaN thin layers with various thicknesses. The GaN layers were overgrown on an Al0.28Ga0.72N layer by the metal‐organic vapor‐phase epitaxy (MOVPE) method. In a GaN layer about 50 nm in thickness, TDs running up in the AlGaN layer pass into the GaN layer and most of them reach the top surface without bending. In thicker GaN layers, on the other hand, many of TDs… Show more
“…7) The formation of hairpins due to stress relief through the interaction between inclined TDs was also reported. 8) A similar inclination of a-type TDs for strain relaxation was also found in undoped AlGaN layers grown on AlN. [9][10][11][12] Notably, most of the previous works focused on the strain relaxation by TD inclination in an AlGaN single layer as well as the effect of Si dopants on the TD inclination, but few experimental results on AlGaN-related multilayered materials with Mg dopants were reported.…”
mentioning
confidence: 54%
“…3, are also formed in the vicinity of the GaN/AlGaN-SL/AlN interface, which was generally considered to result from the interaction between inclined TDs. 8) The inclination of a þ c-type dislocations indicated that the effect of HT-AlN IL is different with the lowtemperature AlN IL, which has no effect on the bending of a þ c-type TDs. 16) To clarify the relaxation mechanism, we also did the planview TEM measurements.…”
The a- and a+c-type threading dislocation (TD) inclinations were observed in Mg-doped tensile-strained GaN/Al0.15Ga0.85N superlattice (SL) with a high-temperature (HT) AlN interlayer (IL). Most of the inclined dislocations are a-type, toward the equivalent [11̄00] line direction, following dislocation climb model, while a+c-type dislocations gliding on (11̄01) second slip plane inclined toward the [112̄0] line direction. The analysis by comparing samples gave no evidence of Mg dopants to affect the TD inclination. The stress evolution, specifically, the stress transformation of the tensile-stress-relieved AlGaN barrier to the compressive-strain-enhanced GaN well caused by the HT-AlN IL, dominantly affected the a- and a+c-type TD inclinations.
“…7) The formation of hairpins due to stress relief through the interaction between inclined TDs was also reported. 8) A similar inclination of a-type TDs for strain relaxation was also found in undoped AlGaN layers grown on AlN. [9][10][11][12] Notably, most of the previous works focused on the strain relaxation by TD inclination in an AlGaN single layer as well as the effect of Si dopants on the TD inclination, but few experimental results on AlGaN-related multilayered materials with Mg dopants were reported.…”
mentioning
confidence: 54%
“…3, are also formed in the vicinity of the GaN/AlGaN-SL/AlN interface, which was generally considered to result from the interaction between inclined TDs. 8) The inclination of a þ c-type dislocations indicated that the effect of HT-AlN IL is different with the lowtemperature AlN IL, which has no effect on the bending of a þ c-type TDs. 16) To clarify the relaxation mechanism, we also did the planview TEM measurements.…”
The a- and a+c-type threading dislocation (TD) inclinations were observed in Mg-doped tensile-strained GaN/Al0.15Ga0.85N superlattice (SL) with a high-temperature (HT) AlN interlayer (IL). Most of the inclined dislocations are a-type, toward the equivalent [11̄00] line direction, following dislocation climb model, while a+c-type dislocations gliding on (11̄01) second slip plane inclined toward the [112̄0] line direction. The analysis by comparing samples gave no evidence of Mg dopants to affect the TD inclination. The stress evolution, specifically, the stress transformation of the tensile-stress-relieved AlGaN barrier to the compressive-strain-enhanced GaN well caused by the HT-AlN IL, dominantly affected the a- and a+c-type TD inclinations.
“…In our opinion [2] the possible origin of this stress is the climb of threading dislocations [3]. The transport of point defects, responsible for the dislocation climb, may occur in bulk [4,5] or at the surface [6,7].…”
GaN films with thickness up to 3 mm were grown by halide vapour phase epitaxy method. Two growth modes were observed: the high temperature (HT) mode and the low temperature (LT) mode. Films grown in HT mode had smooth surface, however the growth stress was high and caused cracking. Films grown in LT mode had rough surface with high density of V-defects (pits), however such films were crack-free. The influence of growth parameters on the pit shape and evolution was investigated. Origins of pits formation and process of pit overgrowth are discussed. Crack-free films with smooth surface and reduced density of pits were grown using combination of the LT and HT growth modes.
“…4) Such In segregation in InGaN quantum well causes discontinuity of quantum well stack and intermixing in the vicinity of the dislocations. 5) The low-temperature buffer layer technique and epitaxial lateral overgrowth (ELO) [6][7][8][9] have been proposed to reduce TDs in the GaN/Al 2 O 3 heteroepitaxial growth system. On the basis of the results of cross-sectional transmission electron microscopy (TEM), Sakai et al reported that the TDs transmitted from the substrates were drastically reduced in the GaN films grown selectively in HVPE.…”
Dislocations in an epitaxial GaN film with a surface (m-GaN) were investigated by means of X-ray diffractometry. It was clarified that a-type screw dislocations existed in the sample by evaluating diffraction contrast on X-ray topographs (XRTs). In addition, local lattice inclinations of the plane toward the [0001] direction were observed with spatial intervals similar to the separation distances of those a-type screw dislocations slipping on the (0001) basal plane and also on other cross-slip planes in the sample.
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