Electrodeposition of Ni-Mg alloys from 1-butyl-3-methylimidazolium chloride/glycerin eutectic-based ionic liquid

Effects of Deposition Potential and Temperature on Co(II) Reduction and Electrocrystallization for Preparing Nanocrystalline Co Coatings in Ethylene Glycol Solution

“…As shown in Figs. 6a and 6b, all of these curves look like common current density transients reported for an ordinary 3D nucleation and growth of a new phase under the diffusion control, 6,18,[20][21][22]39,41,49,51,59 namely, they are characterized by a current density maximum value j max at t max followed by a linear diffusion of Co(II), followed by a current density minishing. Moreover, the nucleation and growth processes are remarkably sensitive to the applied potentials and temperatures.…”

“…7,8,[10][11][12][13][14] For instance, strains, pinholes and microcracks were created in these materials. 7,8,[10][11][12][13][14] Therefore, nonaqueous systems such as dimethyl formamide (DMF), 15 deep eutectic solvents (DES), [16][17][18][19] ionic liquid solvents (ILS), [20][21][22] for the electrodeposition of solid film including metals, alloys and semiconductor materials, 23 are more and more popular since they normally provide attractive features such as outstanding metal ion solubility, excellent thermal stability and wide electrochemical window. Among these nonaqueous, ethylene glycol (EG) systems used as the electrolyte for electrodeposition are more interesting due to the fact that EG is more affordable and environmentally friendly.…”