Electrochemical behavior and electrodeposition of Ni-Co alloy from choline chloride-ethylene glycol deep eutectic solvent

Co-deposition of Co–Ni alloy catalysts from an ethylene glycol system for the hydrogen evolution reaction

“…Before use, the GC electrode was preprocessed based on previous literature. 26,27 Nevertheless, in the electrodeposition experiments, a DC power supply and galvanostatic method were used to prepare Co-Ni alloy coatings and a copper sheet (99.9 wt%) with an exposed area of 0.5 cm 2 (0.5 × 1.0 cm) was used as the plating substrate (cathode) and platinum foil (3 cm 2 ) as the anode. The distance between the cathode and anode in the plating bath was 2 cm, and before use the plating substrate was also preprocessed based on previous literature.…”

“…The ionic liquid (IL) system has become a vital type of electrolyte for success in an aqueous solution system because it represents an important development in the eld of environmental protection and shows enormous potential in the synthesis of functional materials. [24][25][26][27][28] More importantly, ILs can provide a wide electrochemical window, low volatility and high electrical conductivity for electrolysis without the presence of HER. Thus, compared with traditional aqueous systems, these plating techniques from ILs can improve the current efficiency and quality of the electrodeposited coatings, and eliminate the necessity to employ additional additive agents.…”

“…7,10 In addition, they found that their corrosion resistance could be improved with an increase in Co content. Subsequently, Co-Ni alloys were also successfully electrodeposited by Wenruo Li et al 26,27 from choline chloride IL-urea and choline chloride IL-ethylene glycol systems, respectively. They found that the reduction process of the Co-Ni alloy in the choline chloride IL-urea system was irreversible under diffusion control and its electro-crystallization process was three-dimensional instantaneous nucleation growth.…”

Influence of Pre-Adsorbed TiO2 Particles on the Nucleation and Growth Mechanism of Ni in Deep Eutectic Solvent Electro-Codeposition

“…At present, the deep eutectic solvent (DES), a type of ionic liquid proposed by Abbott et al, 14 is widely accepted and studied. A DES has ionic characteristics and is composed of a eutectic mixture of organic compounds, with expansive electrochemical windows, excellent conductivity, and high thermal stability, 15,16 which commonly used consist of quaternary ammonium salts, such as choline chloride (2hydroxy-ethyl-trimethyl ammonium chloride) and metal salts or hydrogen bonding donor substances (such as amides, diols, or carboxylic acids). 14,17 The present research work reports the nucleation and growth mechanism of Ni 2+ under the influence of pre-absorbed TiO 2 particles in a DES at the initial stage of electro-codeposition.…”

Effects of additives on the electrodeposition of Zn Sn alloys from choline chloride/ethylene glycol-based deep eutectic solvent

“…However, electroplating from this medium is generally undesirable due to the evolution of hydrogen at the cathode, which can affect current efficiency and thus the properties of any subsequent Zn-Sn deposits. Aqueous solutions also tend to have narrow potential windows, where ultimately all the above reasons generally limit the electrodeposition of metals and alloys from aqueous electrolytes [17,18]. In addition, acids, bases and cyanide compounds are used in the majority of aqueous Zn-Sn plating baths; these have various drawbacks, such as toxic effluent, the resultant air pollution, and the requirement for high energy consumption [19].…”