2008
DOI: 10.1016/j.jallcom.2007.06.108
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Electrodeposition of CoWP film

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Cited by 25 publications
(12 citation statements)
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“…Recently, it has been reported that electrodeposition method has some advantages over electroless deposition such as lower processing temperature, better control over the deposition technique and thus, a wide range of compositions [12][13][14][15]. In the present work, Co-W-P coatings have been made on plain carbon steel by the electrodeposition method and their microstructures, hardness and corrosion protective properties have been studied.…”
Section: Introductionmentioning
confidence: 96%
See 1 more Smart Citation
“…Recently, it has been reported that electrodeposition method has some advantages over electroless deposition such as lower processing temperature, better control over the deposition technique and thus, a wide range of compositions [12][13][14][15]. In the present work, Co-W-P coatings have been made on plain carbon steel by the electrodeposition method and their microstructures, hardness and corrosion protective properties have been studied.…”
Section: Introductionmentioning
confidence: 96%
“…Co-W-P thin films can be fabricated by both electroless [8][9][10][11] and electrochemical deposition methods [12][13][14][15]. Recently, it has been reported that electrodeposition method has some advantages over electroless deposition such as lower processing temperature, better control over the deposition technique and thus, a wide range of compositions [12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%
“…Co-W-P thin films can be deposited by both electroless [10][11][12] and electrochemical [17][18][19][20] deposition methods. The electroless plating, however, is widely used to deposit the metallic capping/barrier layers because it is a very simple and inexpensive method, does not require much instrumentations and offers highly selective and conformal deposition [5,12,15].…”
Section: Introductionmentioning
confidence: 99%
“…Recently, many works [5,6] have been carried out to study the microstructure, the ingredient and the application of Co(Ni)WP films, especially on the study of diffusion barriers and capping layers for Cu metallization in the ultra-large scale integration technology. Zhu et al [7] had investigated the formation mechanism of the electroless deposited CoWP films on Si substrate, which indicated the CoWP initially nucleated around the wet activation sites and then growed rapidly.…”
Section: Introductionmentioning
confidence: 99%