This paper reports on a three-dimensional thermal modeling approach for a lithium-ion battery (LIB). The combined effects of the thermal and electrical contact resistances between the current collecting tab of an LIB cell and the lead wire connecting the cell to an external cycler are considered explicitly in addition to the heat generated as a result of electrochemical reactions and ohmic heating in the electrode region of the battery cell. The effect of electrical contact resistance is taken into account when calculating current collecting tab heating, and the effect of thermal contact resistance is included in the heat flux boundary condition at the contact area between the current collecting tab and the lead wire. The three-dimensional thermal modeling is validated by comparing the modeling results with experimental temperature distributions from IR images during discharge in an LIB cell.
This work was supported by EPRI Contract No. RP8001-4. The authors would like to thank F. Goodman of EPRI and G. Fiegl of UniSil for the helpful discussions and the growth of MCZ samples.
The effect of fluid flow, transport, and reaction on the shape evolution of two-dimensional cavities during wet chemical etching was studied. Finite element methods were employed to solve for the fluid velocity profiles and for the etchant concentration distribution in cavities of arbitrary shape. A moving boundary scheme was developed to track the shape evolution of the etching cavity. In the case of pure diffusion and under mass-transfer control, a mask with finite thickness resulted in significantly better etch factor (etch anisotropy) as compared to an infinitely thin mask, albeit the etch rate was essentially unaffected. With fluid flow past the cavity, the etch rate increased fourfold and the etch factor increased by 40% as compared to pure diffusion, under the conditions examined. In addition, the etch rate, etch factor, and cavity wall profiles showed a strong dependence on etch time as the cavity aspect ratio (depth/width) increased with time during etching. ) unless CC License in place (see abstract). ecsdl.org/site/terms_use address. Redistribution subject to ECS terms of use (see 128.111.121.42 Downloaded on 2015-06-26 to IP
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