1984
DOI: 10.1016/0146-3535(84)90054-6
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Electrodeposited layers of CuInS2, CuIn5S8 and CuInSe2

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Cited by 18 publications
(6 citation statements)
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“…With decreasing [Cu]/[In] ratio up to 0.28, the signal from this secondary phase decreases and finally disappears, which indicates that the chalcopyrite phases may play an important promotion role in the formation of CuIn 5 S 8 via electrodeposition technique. This result is almost in agreement with that observed by Hodes et al [29], which have indicated that CuIn 5 S 8 spinel phase starts to be formed and mixed with some chalcopyrite when the Cu/In ratio is made less than 0.5. For sample deposited from molar ratio of ([Cu]/ [In] = 0.28), XRD pattern shows only the peaks associated to the CuIn 5 S 8 cubic spinel phase, indicating that the crystalline nature of the CuIn 5 S 8 improves at this corresponding molar ratio.…”
Section: Electrochemical Measurementssupporting
confidence: 94%
“…With decreasing [Cu]/[In] ratio up to 0.28, the signal from this secondary phase decreases and finally disappears, which indicates that the chalcopyrite phases may play an important promotion role in the formation of CuIn 5 S 8 via electrodeposition technique. This result is almost in agreement with that observed by Hodes et al [29], which have indicated that CuIn 5 S 8 spinel phase starts to be formed and mixed with some chalcopyrite when the Cu/In ratio is made less than 0.5. For sample deposited from molar ratio of ([Cu]/ [In] = 0.28), XRD pattern shows only the peaks associated to the CuIn 5 S 8 cubic spinel phase, indicating that the crystalline nature of the CuIn 5 S 8 improves at this corresponding molar ratio.…”
Section: Electrochemical Measurementssupporting
confidence: 94%
“…The classic methodology is coelectrodeposition, described for CdTe deposition in work by Kröger et al The coelectrodeposition process is low-cost and simple, given the right solution chemistry. Many binary compounds have been formed using coelectrodeposition at a controlled potential or current in a single solution containing precursors for both elements. One of the drawbacks to coelectrodeposition is limited control over the process. The potential must be carefully controlled, within a few millivolts.…”
Section: Introductionmentioning
confidence: 99%
“…[ 47,48 ] ED can serve either to directly deposit the compound semiconductors CuInSe 2 or CuInS 2 [49][50][51] or to electroplate metallic Cu-In or Cu-In-Ga precursors. [52][53][54] In the case of metallic precursors, an annealing step at temperatures between 500 and 600 °C is used to react the precursor with chalcogens (S, Se) to form the semiconductor phase. In the case where all the precursor elements (Cu-In-Se-S) are already deposited by ED, the annealing is still mandatory to enable grain growth and improve layer crystallinity.…”
Section: Cigsmentioning
confidence: 99%