Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders

Montesperelli, Giampiero; Rapone, M.; Nanni, Francesca; Travaglia, P; Riani, Paola; Marazza, R.; Gusmano, G.

doi:10.1002/maco.200804098

Cited by 35 publications

(14 citation statements)

References 13 publications

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“…For SAC (0505) and SAC (0505)-0.05Ni solders, the results show that an initial elastic region followed by a viscoplastic plateau, which results from the balancing of two antagonist mechanisms: work hardening and dislocations unpinning. 23 Such behavior has to be referred to the fact that at room temperature these alloys work in creep conditions, since room temperature exceeds half the absolute melting temperature of the solder alloys. Figure 4a (Fig.…”

Section: Microstructural Investigationmentioning

confidence: 99%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

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The aim of the present work is to develop a comparative evaluation of the microstructural and mechanical deformation behavior of Sn-Ag-Cu (SAC) solders with the minor addition of 0.05 wt.% Ni. Test results showed that, by adding 0.05Ni element into SAC solders, generated mainly small rod-shaped (Cu,Ni) 6 Sn 5 intermetallic compounds (IMCs) inside the b-Sn phase. Moreover, increasing the Ag content and adding Ni could result in the change of the shape and size of the IMC precipitate. Hence, a significant improvement is observed in the mechanical properties of SAC solders with increasing Ag content and Ni addition. On the other hand, the tensile results of Ni-doped SAC solders showed that both the yield stress and ultimate tensile strengths decrease with increasing temperature and with decreasing strain rate. This behavior was attributed to the competing effects of work hardening and dynamic recovery processes. The Sn-2.0Ag-0.5Cu-0.05Ni solder displayed the highest mechanical properties due to the formation of hard (Cu,Ni) 6 Sn 5 IMCs. Based on the obtained stress exponents and activation energies, it is suggested that the dominant deformation mechanism in SAC (205)-, SAC (0505)-and SAC (0505)-0.05Ni solders is pipe diffusion, and lattice self-diffusion in SAC (205)-0.05Ni solder. In view of these results, the Sn-2.0Ag-0.5Cu-0.05Ni alloy is a more reliable solder alloy with improved properties compared with other solder alloys tested in the present work.

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Section: Microstructural Investigationmentioning

confidence: 99%

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad

El-Taher

2014

Journal of Elec Materi

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“…3) can be used to provide quantitative impedance parameters in order to complement the qualitative analysis. In the last decade, such technique and particularly the proposed equivalent circuit have been intensively utilized by a number of researchers [11,15,19,[22][23][24][25][26][27][28][29][30][31].…”

Section: Equivalent Circuitmentioning

confidence: 99%

Electrochemical corrosion response of a low carbon heat treated steel in a NaCl solution

Osório

Peixoto

Garcia

et al. 2009

Materials & Corrosion

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Dual-phase (DP) steels are produced from a specific heat treatment procedure and have recently emerged as a potential class of engineering materials for a number of structural and automobile applications. Such steels have high strength-to-weight ratio and reasonable formability. The present study aims to investigate the effects of four different and conventional heat treatments (i.e., hot rolling, normalizing, annealing, and intercritical annealing) on the resulting microstructural patterns and on the electrochemical corrosion behavior. Electrochemical impedance spectroscopy (EIS) and Tafel plots were carried out on heat treated steel samples in a 0.5 M NaCl solution at 25 8C with neutral pH. An equivalent circuit analysis was also used to provide quantitative support for the discussions. The normalizing and the annealing heat treatments have provided the highest and the lowest corrosion resistances, respectively. The intercritical annealing and as-received (hot rolled) low carbon steel samples have shown similar corrosion behavior. Although a deleterious effect on the corrosion resistance has been verified for DP steel due to the residual stress from the martensite formation, it combines good mechanical properties with intermediate electrochemical corrosion resistance.

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“…The new alloy, its properties and characteristics will be presented and discussed in a subsequent paper [2].…”

Section: Introductionmentioning

confidence: 99%

Phase equilibria in the In–Sn-rich part of the Cu–In–Sn ternary system

Riani

Cacciamani

Parodi

et al. 2009

Journal of Alloys and Compounds

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Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders

Cited by 35 publications

References 13 publications

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Electrochemical corrosion response of a low carbon heat treated steel in a NaCl solution

Phase equilibria in the In–Sn-rich part of the Cu–In–Sn ternary system

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