Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Hammad, A.E.; El-Taher, A. M.

doi:10.1007/s11664-014-3323-y

Cited by 13 publications

(7 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Similar microstructures were reported in other SAC studies [11]. In Figure 4 and Figure 5, the needle-like particles are identified as Ag3Sn IMCs, whereas an irregular polygon of IMC particles are Cu6Sn5.…”

Section: Microstructural Characterization Of Soldersupporting

confidence: 87%

See 1 more Smart Citation

Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

et al. 2018

View full text Add to dashboard Cite

The Lead-free solders (SAC) with low Ag content have been identified as crucial solder to replace the traditional Sn-Pb solder. The main discussion was presented in two major area of microstructural investigation and mechanical properties of SAC305 and SAC405. Composition and microstructure of SAC solder alloys were investigated by an optical microscope and SEM (Scanning Electron Microscopy). Mechanical properties such as tensile tests and hardness test of the lead-free solder alloys have been tested in this research. Different Ag content and constant Cu content of lead-free solder has been considered in this investigation and compare the mechanical properties of SAC305 and SAC405 solders. From this investigation, tensile strength and hardness have been increased with increased of Ag content.

show abstract

Section: Microstructural Characterization Of Soldersupporting

confidence: 87%

“…Reducing the Ag content can improve the reliability of SAC solder joints in dynamic environments. Addition of alloying elements such as SiC, Bi, Ni, and Ce will enhance the properties of SAC solder alloys in lead-free solder alloys [3][4][5][6][7][8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

et al. 2018

View full text Add to dashboard Cite

show abstract

“…Reducing the Ag content can improve the reliability of SAC solder joints in dynamic environments. It has been proved that to further enhance the properties of SAC solder alloys, alloying elements such as Sic, Bi, Ni and, Ce have been added in lead-free solder alloys [3,6,11].…”

Section: Introductionmentioning

confidence: 99%

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

Kumar

Gergely

Horváth

et al. 2018

Powder Metallurgy Progress

View full text Add to dashboard Cite

The Sn–Ag–Cu (SAC) solders with low Ag or Cu content have been identified as promising candidates to replace the traditional Sn–Pb solder. In this study, an extensive discussion was presented on two major area of mechanical properties and microstructural investigation of SAC305 and SAC405. In this chapter, we study the composition, mechanical properties of SAC solder alloys and microstructure were examined by optical microscope and SEM and mechanical properties such as tensile tests, hardness test and density test of the lead solder alloys were explored. SAC305 and SAC405 alloys with different Ag content and constant Cu content under investigation and compare the value of SAC305 and SAC405. From this investigation, it was reported that tensile strength is increased, with an increase of Ag content and hardness and density were also increases in the same manner.

show abstract

“…Metallic nanoparticles, such as Ag, Ni and Ga [1][2][3], and non-metallic nanoparticles, such as TiO 2 , SiC and Al 2 O 3 [4][5][6], have been studied, promising to make excellent reinforcement. For instance, the nano-scaled particles can hinder the grain boundary dislocation to enhance the mechanical properties of the solder joints [7]; nano Ag with high thermal conductivity can ease the thermal aging failure [1]; nano SiC with high hardness are doped to improve the mechanical properties [5].…”

Section: Introductionmentioning

confidence: 99%

The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints

Sun

Chan

2015

J Mater Sci: Mater Electron

View full text Add to dashboard Cite

This research was intended to establish a scientific relationship between the changes of the weight percent of CNTs in the solder blocks and the changes of mechanical properties of the doped solder joints. The impact of reflow soldering induced dopant redistribution has been detailedly discussed. It was proved to be a principle reason that led to the changes of the weight percent of CNTs in the doped solder joints, and finally influenced the mechanical properties. The drag force caused by the outward flow of the solder flux and the buoyancy force caused by the density gap were the main inducing factors for the redistribution. By experimental methods, CNTs doped Sn58Bi solder pastes with the doping amount of 0.025, 0.05, 0.100, 0.150 and 0.200 wt% were studied to analyze this phenomenon. Our findings showed that with doping amount of 0.100 wt%, the doped solder block seemed saturated. After doping more CNTs, the final weight percent of CNTs was hardly increased. Also, the excess CNTs preferred to aggregate at the near surface region of the solder block, making the surface became darker and coarser. To analyze the real conditions, CNTs doped Sn58Bi solder joints with different original doping amount were studied to detect the changes of mechanical properties. According to the results, the highest shear stress was found to be 77.3 MPa with the doping amount of 0.050 wt%. After the doping amount overpassed 0.100 wt%, the shear stress decreased sharply. Also, via morphology observation, the doped CNTs were found aggregated at the interface of the solder joints seriously with the doping amount of 0.200 wt%.

show abstract

Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni

Cited by 13 publications

References 32 publications

Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

Investigating the Microstructural and Mechanical Properties of Pure Lead-Free Soldering Materials (SAC305 & SAC405)

The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints

Contact Info

Product

Resources

About