Electrically Conductive Adhesives (ECAs)

Lu, Daoqiang; Wong, Ching‐Ping

doi:10.1007/978-0-387-78219-5_11

Cited by 31 publications

(33 citation statements)

References 52 publications

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“…Most of the above-mentioned studies on AlN-polymer composites focused on their applications as thermal interface materials (TIM), which is usually in the thermal management area of integrated circuits (IC) [18]. It is obvious that AlN-filled silicon rubber has not been systematically investigated with respect to its application as a high-voltage outdoor insulator.…”

Section: Introductionmentioning

confidence: 99%

The Effects of Aluminum-Nitride Nano-Fillers on the Mechanical, Electrical, and Thermal Properties of High Temperature Vulcanized Silicon Rubber for High-Voltage Outdoor Insulator Applications

Liu

et al. 2019

Materials

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AlN nanoparticles were added into commercial high-temperature-vulcanized silicon rubber composites, which were designed for high-voltage outdoor insulator applications. The composites were systematically studied with respect to their mechanical, electrical, and thermal properties. The thermal conductivity was found to increase greatly (>100%) even at low fractions of the AlN fillers. The electrical breakdown strength of the composites was not considerably affected by the AlN filler, while the dielectric constants and dielectric loss were found to be increased with AlN filler ratios. At higher doping levels above 5 wt% (~2.5 vol%), electrical tracking performance was improved. The AlN filler increased the tensile strength as well as the hardness of the composites, and decreased their flexibility. The hydrophobic properties of the composites were also studied through the measurements of temperature-dependent contact angle. It was shown that at a doping level of 1 wt%, a maximum contact angle was observed around 108°. Theoretical models were used to explain and understand the measurement results. Our results show that the AlN nanofillers are helpful in improving the overall performances of silicon rubber composite insulators.

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Section: Introductionmentioning

confidence: 99%

The Effects of Aluminum-Nitride Nano-Fillers on the Mechanical, Electrical, and Thermal Properties of High Temperature Vulcanized Silicon Rubber for High-Voltage Outdoor Insulator Applications

Liu

et al. 2019

Materials

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“…[1][2][3][4] The reason for utilizing high filler contents are three folded; (1) to decrease the mechanical stresses on die; match the mechanical properties of silicon (i.e., thermal expansion stress reduction); (2) to have low enough permittivity and electrical conductivity to control the electric field above the active device with least ionic mobility; and (3) cost; semiconductor grade thermosets resins are expensive and cost reduction is achieved by using high amounts of inorganic fillers (up to 91% in weight), see Fig. 1.…”

Section: Introductionmentioning

confidence: 99%

Change in dielectric relaxation with the presence of water in highly filled composites

Tuncer

2017

J. Adv. Dielect.

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It is important to determine the dielectric characteristics of semiconductor encapsulation materials based on epoxy resins. We employed the dielectric spectroscopy technique to investigate the dielectric relaxation in the presence of water and how it changes the relaxation. It was observed that the dielectric relaxation of the material was significantly influenced by absorbed water, the local segmental motion (also known as Johari-Goldstein ( ) relaxation) was influenced most by the presence of the water, it was modified by the wet sample compared to dry one, and required high activation energy. The relaxation related to the glass transition was contributed by the cooperative motion (the -relaxation) of the epoxy resin system. The -relaxation was shifted to a low temperature in the wet sample compared to dry one. The relaxation was modeled with a clear Vogel-Fulcher-Tammann-Hesse (VFTH) behavior; the Vogel temperature of the wet sample was 8 K lower than the dry sample. The presence of water acts as a plasticizer for the molecular relaxation, and speed-up the cooperative process. The measured data were also used to estimate the electrical properties of the resin system by employing an effective-medium model together with a porous media continuum model by taking into account the physical properties of the system. It is already known that the influence of water in semiconductor packaging is important in sensitive applications. The presented measurements and the analysis method would be appreciated within the semiconductor packaging community to improve material selection and performance evaluation efforts.

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“…The comparison of the three terms shows that it is sufficient to only take the first term f 1 (r) for considering the approximate solution of the filling time. That is, by ignoring f 2 (r) and f 3 (r), the equation 12 or the filling time under the inflow of free droplets becomes 2 3 2 cos d c…”

Section: Figure 5 Diagram Of Tsv Dispensing With Free Dropletsmentioning

confidence: 99%

“…The vias are filled with solder paste and then reflowed. Pre-applied underfill has the common challenges of non-uniform deposition, difficult vision recognition of chip alignment, high investment of the wafer-level facilities, short shelf-life and poor wetting of the underfilm [3].…”

Section: Introductionmentioning

confidence: 99%

Through silicon underfill dispensing for 3D die/interposer stacking

Lee

Lau

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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This study describes a through-silicon-underfill dispensing that the encapsulant is dispensed through through-silicon-vias (TSVs). The TSVs function as entrances for encapsulant dispensing or paths for fluid flow. Typically, the inflow for TSV dispensing may be flow with a constant speed or free droplets. A model was developed to investigate the filling time and the pressure distribution for the quasi-steady, radial and laminar flow between parallel plates. Compared with free droplets, a constant inflow has shorter filling time at the expense of increasing the fluid pressure. 3D stacking with the same-size interposers forms several planar sidewalls. Encapsulant may flow out from the edges of the sidewalls and form an edge flood failure if the edge flow of an underfill can overcome the surface force. An optimized pattern of TSVs was designed for the underfill of a 3D package to identify the trade-off between the filling efficiency and the lower risk of the edge flood. In each interposer, the TSVs are classified into two groups: the central group is dispensed by a constant inflow whereas the outer group is dispensed by free droplets; the inflow of free droplets eliminates the risk of an edge flood. A four-stack 3D package with the optimized TSV pattern was developed for validation. Edge dispensing was used to fill the gaps at the bottom levels as much as possible. Subsequently, the remaining gaps were encapsulated by TSV dispensing (with both a constant inflow and an inflow of free droplets). Inspections by scanning acoustic microscopy and crosssectioning verified that the combined underfill could result in a void-free encapsulation and suitable fillets.

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Electrically Conductive Adhesives (ECAs)

Cited by 31 publications

References 52 publications

The Effects of Aluminum-Nitride Nano-Fillers on the Mechanical, Electrical, and Thermal Properties of High Temperature Vulcanized Silicon Rubber for High-Voltage Outdoor Insulator Applications

The Effects of Aluminum-Nitride Nano-Fillers on the Mechanical, Electrical, and Thermal Properties of High Temperature Vulcanized Silicon Rubber for High-Voltage Outdoor Insulator Applications

Change in dielectric relaxation with the presence of water in highly filled composites

Through silicon underfill dispensing for 3D die/interposer stacking

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