1979
DOI: 10.1049/el:19790380
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Electrical properties of silicon-implanted furnace-annealed silicon-on-sapphire devices

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Cited by 40 publications
(2 citation statements)
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“…This has been attributed to the thermal and lattice mismatches between film and substrate. Successful efforts have been made in recent years to improve films for device applications (5)(6)(7). Ideally, however, the use of the as-grown Si films without regrowth steps would be preferred.…”
mentioning
confidence: 99%
“…This has been attributed to the thermal and lattice mismatches between film and substrate. Successful efforts have been made in recent years to improve films for device applications (5)(6)(7). Ideally, however, the use of the as-grown Si films without regrowth steps would be preferred.…”
mentioning
confidence: 99%
“…6). Both structural and electrical characteristics of this sandwich improved by an order of magnitude [8].…”
Section: Quantities Measured In Bs Analysismentioning
confidence: 96%