1972
DOI: 10.1016/0038-1098(72)91173-8
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Electrical properties of n-type Si layers doped with proton bombardment induced shallow donors

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1973
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Cited by 81 publications
(18 citation statements)
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“…So far, the common explanation for this behavior, as given by Ohmura et al, 1 is that a shallow donor is the result of a hydrogen ion located in an interstitial hole. The shallow donors induced by proton implantation in n-type silicon have stimulated a great deal of interest in microelectronic processes, which in many cases, can have an advantageous effect.…”
Section: Introductionmentioning
confidence: 91%
“…So far, the common explanation for this behavior, as given by Ohmura et al, 1 is that a shallow donor is the result of a hydrogen ion located in an interstitial hole. The shallow donors induced by proton implantation in n-type silicon have stimulated a great deal of interest in microelectronic processes, which in many cases, can have an advantageous effect.…”
Section: Introductionmentioning
confidence: 91%
“…The formation of H-related shallow donors is another important phenomenon. It was found for the first time that the shallow donors can be produced in proton (H + )-implanted Si annealed over a temperature range of 300-500 • C with a donor ionization energy of about 26 meV, and disappear at 600 • C. 8) Thereafter, the excess shallow donors of high concentration have also been observed in neutron-irradiated FZ Si:H 2 at annealing temperatures ranging from 400-500 • C. 9,10) This phenomenon is very different from that of other crystalline Si without hydrogen, for example, FZ Si:Ar. Therefore, the donors are often called hydrogen-related donors.…”
Section: Introductionmentioning
confidence: 99%
“…Irradiation of crystalline silicon with protons in the energy range of keV to MeV and successive annealing at temperatures up to 500 °C induces shallow donor type defects [3,4] with ionization energies of several 10 meV [5][6][7]. Previous investigations have shown that various different energy levels exist, depending on the temperature of the annealing step [6,8].…”
Section: Introductionmentioning
confidence: 99%