Electrical Characteristics of $\hbox{Ba}_{0.6}\hbox{Sr}_{0.4} \hbox{TiO}_{3}$ Thin-Film Chip Capacitors for Embedded Passive Components

Rahayu, Rheza; Kang, Mingyu; Do, Youngwoong; Hwang, Jin‐Ha; Kang, Chong‐Yun; Yoon, Seok–Jin

doi:10.1109/led.2012.2224088

Cited by 9 publications

(6 citation statements)

References 12 publications

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“…Bearing in mind the existing trend in the electronic industry to produce smaller and smaller devices, one of the examined approaches is embedding passive and active components into printed circuit boards (PCBs). So far many research works concerning thin- and thick-film passive components embedded in PCBs have been reported by Rahayu et al (2013), Akahoshi et al (2019), Balmont et al (2018) and Rovensky et al (2018). However, to produce more functional devices, such solutions are not sufficient.…”

Section: Introductionmentioning

confidence: 99%

Investigations of temperature sensor embedded into PCB

Janeczek

Araźna

Stęplewski

et al. 2020

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Purpose The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties. Design/methodology/approach A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor circuitry was fabricated and embedded into a PCB with the proposed technologies. Finally, properties of the embedded structures were examined as well-functional parameters of the sensor circuitries. Findings The described investigation results confirmed that the proposed technologies using an epoxy resin or standard materials used for PCB’s production allowed to successfully produce sensors embedded into PCBs. This technology did not have a negative significant impact either on quality of solder joints of the assembled transponder IC or on functional properties of the embedded sensor. Apart from the identification data, the reported sensor can provide information about a selected property of its environment, e.g. temperature when its internal temperature sensitive element is used or other factors with the use of external sensitive elements, such as humidity. Research limitations/implications It is planned to carry on the reported investigations to examine other types of sensor circuitries capable of indicating e.g. humidity level and to evaluate influence of the proposed technology on their functional properties. Practical implications The reported sensor circuitries can be successfully used in electronic industry in internet of things systems not only to identify monitored electronic devices, but also to control selected parameters of external environment. This creates opportunity to detect device malfunction by detecting local temperature growth or to analyze its environment, which might allow to predict failure of controlled products using radio waves. This advantage seems to be extremely beneficial for applications, such as space, aviation or military, in which embedded sensor systems may lead to enhancing reliability of electronic devices by reacting on occurred failures in a more efficient way. Originality/value This study demonstrates valuable information for engineers conducting research on sensor components embedded into PCBs. The reported technologies are quite simple and cost-effective because of the use of standard materials known for PCB’s production or an epoxy resin which could be treated as an additional encapsulant material enhancing mechanical properties of the embedded sensor transponder IC.

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Section: Introductionmentioning

confidence: 99%

Investigations of temperature sensor embedded into PCB

Janeczek

Araźna

Stęplewski

et al. 2020

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“…One of the methods which enable control of the operation of electronic devices is embedding electronic components into printed circuit boards (PCBs). So far, many research results have been published on the process of embedding thin‐film [ 12–14 ] and thick‐film [ 15,16 ] passive components as well as passive or active components intended for surface mount technology assembly. [ 17–20 ] Such embedded electronic components are typically used to reduce the dimensions of designed PCBs.…”

Section: Introductionmentioning

confidence: 99%

Reliability Investigations of a Sensor System Embedded into Printed Circuits Boards

Janeczek

Araźna

Stęplewski

et al. 2020

Physica Status Solidi (a)

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Embedded components are one of the current trends in electronics, allowing to produce more compact devices with increased functionality. Such components can be applied, among others, in fabrication devices used in the Internet‐of‐Things technology or in special industries. Therefore, their reliability plays a key role due to safety requirements and high deployment costs. Herein, the thermal reliability of a system of sensors embedded into a printed circuit board (PCB) is examined. The samples produced are exposed to temperature cycling, −40 °C/+105 °C, or high temperature/high humidity, 85 °C/85% relative humidity (RH). The quality of solder joints is evaluated on the basis of X‐ray inspection and cross sections before and after the exposure mentioned earlier. The tests show no damage to the solder joints of the samples subjected to reliability testing in high‐temperature/high‐humidity conditions, irrespective of the solder alloy used. Cracks appear after 500 cycles, −40 °C/+105 °C, in samples soldered with Sn99Cu1 and after 1000 temperature cycles in both Sn99Cu1 and LFM‐48S (SnAg3.0Cu0.5) solders. The presented results are used for efficient embedding of electronic components into PCBs. Consequently, more space is gained for other components and the size of the electronic products is minimized.

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“…Many metal oxides have been found to take RS effect, such as NiO, GdO x , ZrO 2 , Al 2 O 3 , HfO 2 , and BiFeO 3 . Among these researches, the switching mechanisms and the performance of devices are two hot issues . There are two types of RS in metal oxides, namely bipolar RS and unipolar RS.…”

Section: Introductionmentioning

confidence: 99%

A Study on Set Process and Its Influence on Performance of Resistive Switching

Yan

2017

Physica Status Solidi (a)

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In this paper, it has been found that resistive switching (RS) types are dominated by magnitude and polarities of set voltage (V set ). The difference in V set and its influences on RS behaviors between bipolar and unipolar RS are studied. There are two types of polarity dependence of V set in devices, which comes from the influence of defects on breakdown. The resistances of low resistance state (LRS) of bipolar are much smaller than these of unipolar RS under the same current compliance. The LRS resistances of bipolar RS show complex dependence on V set . It reveals that the oxygen vacancy (V O ) filaments properties and RS types are controlled by the intrinsic properties of breakdown and remnant defects.

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Electrical Characteristics of $\hbox{Ba}_{0.6}\hbox{Sr}_{0.4} \hbox{TiO}_{3}$ Thin-Film Chip Capacitors for Embedded Passive Components

Cited by 9 publications

References 12 publications

Investigations of temperature sensor embedded into PCB

Investigations of temperature sensor embedded into PCB

Reliability Investigations of a Sensor System Embedded into Printed Circuits Boards

A Study on Set Process and Its Influence on Performance of Resistive Switching

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