Electrical and tensile properties of Cu-ThO2, Au-ThO2, Pt-ThO2 and Au-Al2O3, Pt-Al2O3 alloys

Electrical resistivity of Au-ZnO nanocomposite films

“…(9), where the resistivity components were previously defined, treating the M-S and GEM equations as independent and additive. The resistivity of the composite film (q c ) over the entire composition range is described as a function of the two phenomena.…”

“…23 Figure 4 shows the calculated or expected average grain sizes for the film compositions in the range of ZnO concentrations between 0 and 0.3 by volume fraction, following Eq. (9), and based on the previously determined value R ¼ 0.49. Assuming an error in the determination of average grain size of 650 nm (25%) for the 0.1 volume fraction ZnO film used to determine the reflection coefficient, the value would lie in the range of 0.35 < R < 0.55.…”

“…Percolation theory is typically implemented for investigations of materials prepared so that the crystal structure of the mixed phases is independent of composition, such as by flame spraying, sintering, or compression molding. 14,16,17 Increases in electrical resistivity due to electron scattering are typically considered where the composition range of the dispersed, poorly conductive phase is on the order of a few mass percent, 1,7,9,18,19 well below the threshold where percolation theory begins to play a dominant role. The presently investigated system and composition range required a more general model combining percolation theory and electron scattering.…”

Mechanical and electrical performance of thermally stable Au–ZnO films

“…However, many materials with very fine grain sizes have shown evidence of stress-induced grain growth, which leads to a decrease in strength. Studies conducted on nanocrystalline materials [21][22][23][24] suggest this type of grain growth can be attributed to grain-boundary sliding, diffusion, and grain rotation; therefore, if these are reduced, grain growth should be slowed or even stopped. Impurities introduced into the system can stabilize nanocrystalline microstructures by reducing grain boundary mobility and thereby stopping grain growth [17,[25][26][27].…”

“…Additionally, high currents passed through the switch can lead to micro-welding from Joule heating, followed by detrimental deformation when the contact is broken [9,10]. In order to increase the lifetime of these contacts, numerous different techniques are used to increase the wear resistance by increasing the hardness of Au: grain size reduction [11][12][13][14], addition of solid solution impurities [3,13,[15][16][17], deposition of nanolaminate structures [18][19][20], or the introduction of small oxide particles [15,21,22]. However, all of these strengthening techniques can substantially increase the resistivity of Au.…”