2001
DOI: 10.1023/a:1011469102224
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Cited by 22 publications
(8 citation statements)
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“…An additional oxidation process was applied to sharpen the structure before deposition of either a gold or platinum film by metal organic chemical vapor deposition (MOCVD). A final layer of insulating SiO 2 or SiO 2 /Si 3 N 4 sandwich was deposited, before a short period of maskless UV exposure to remove the very tops of the insulating material covering the pyramid,thus creating nanocone electrodes [50,51]. The electrochemical characterization of these types of nanoelectrodes was recently reported [52].…”
Section: Non-high-resolution Techniquesmentioning
confidence: 99%
“…An additional oxidation process was applied to sharpen the structure before deposition of either a gold or platinum film by metal organic chemical vapor deposition (MOCVD). A final layer of insulating SiO 2 or SiO 2 /Si 3 N 4 sandwich was deposited, before a short period of maskless UV exposure to remove the very tops of the insulating material covering the pyramid,thus creating nanocone electrodes [50,51]. The electrochemical characterization of these types of nanoelectrodes was recently reported [52].…”
Section: Non-high-resolution Techniquesmentioning
confidence: 99%
“…The conical microelectrode arrays were fabricated by photolithographic and reactive ion etching techniques, as described in Refs [23,24], and Figure 2 shows a scheme of the fabrication procedure. The substrate material, a p-type (100) silicon wafer of 6 -10 W cm À1 electrical resistivity ( Fig.…”
Section: Preparation Of Microelectrode Arraysmentioning
confidence: 99%
“…Pt films deposited on the top of cathodes and anodes of pacemakers serve as electrodes for treatment of human heart disease . Several techniques including sputtering, physical vapour deposition, radiofrequency sputtering, electodeposition and metal–organic chemical vapour deposition (MOCVD)/atomic layer deposition (ALD) have been used to produce Pt films on the components of medical devices. Among these techniques, MOCVD/ALD seems to be suitable for deposition of films with required surface morphology onto substrates with various geometric shapes and sizes.…”
Section: Introductionmentioning
confidence: 99%