Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

Wang, Jianjian; Yang, Yang; Guo, Ping

doi:10.1016/j.procir.2018.05.017

Cited by 7 publications

(7 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In 1994, the elliptical vibration cutting (EVC) was proposed by Shamoto and Moriwaki [16]. As follows, the machining feasibilities of EVC on many brittle materials like silicon [17,18], reaction-bonded silicon carbide [7], tungsten carbide [19,20], and harden steel [21] has been verified. During EVC process, the subsurface damage can be effectively suppressed since the transient depth of cut (DOC) is much smaller than the nominal DOC [22].…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

View full text Add to dashboard Cite

In this paper, molecular dynamics simulations are carried out to investigate the cutting mechanism during the hybrid machining process combined the thermal and vibration assistants. A modified cutting model is applied to study the material removal behavior and subsurface damage formation in one vibration cycle. The results indicate that during the hybrid machining process, the dominant material removal mechanism could transform from extrusion to shearing in a single vibration cycle. With an increase of the cutting temperature, the generation and propagation of cracks are effectively suppressed while the swelling appears when the dominant material removal mechanism becomes shearing. The formation mechanism of the subsurface damage in one vibration cycle can be distinct according to the stress distribution. Moreover, the generation of the vacancies in workpiece becomes apparent with increasing temperature, which is an important phenomenon in hybrid machining process.

show abstract

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Liu

Chu

et al. 2021

Nanoscale Res Lett

View full text Add to dashboard Cite

show abstract

“…The maximum value of critical undeformed chip thickness is about nine times that achieved without vibration assistance. Obviously, the higher critical undeformed chip thickness obtained by applying 1D UVC, as compared to other vibration assisted machining systems [21][22][23][24][25][26], is significant to raise the machining efficiency of micro structured silicon components in the ductile region.…”

Section: Characteristics Of Sloping Groovesmentioning

confidence: 99%

“…It is noted that the speed of 200 mm/min used in the 1D UVC system is higher than that adopted in other 2D/3D vibration systems, e.g. 3 mm/min [23]. Hence, a model for calculating the material removal length can be used to predict the length of the tool marks imprinted on the machined surface.…”

Section: Verification Of the Modelmentioning

confidence: 99%

“…Ultrasonic vibration cutting (UVC) is regard as a better method of achieving longer tool life, lower cutting force, and better surface quality as compared with conventional cutting (CC) method [20][21][22]. For silicon materials, the critical undeformed chip thickness obtained by UVC was proved to be much larger than that resulting from CC [22][23]. UVC is generally classified into 1D and 2D/3D system according to the number of vibration directions [22,24].…”

Section: Introductionmentioning

confidence: 99%

“…Later on, it was successfully applied in the ductile cutting of brittle materials [25]. 2D/3D UVC can generate lower forces and thinner chips, which is generally thought to be more beneficial to the ultraprecision cutting of brittle materials [22,24], but its vibration frequency is limited by the more complex structure and control system compared with that of 1D UVC [20][21][22][23][24][25][26][27]. Hence, the cutting speed and material removal rate of 1D UVC is higher than that of 2D/3D UVC, and thus, is more suitable for industrial application.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves

2019

View full text Add to dashboard Cite

Structured complex silicon components have the potential to develop breakthrough applications in solar cells, biomedical engineering, microfluidics, and MEMS. As silicon is a typical brittle material, ultrasonic vibration diamond cutting has been approved as a promising method to achieve better cutting performance compared to other conventional methods. However, few studies have been conducted on the cutting of structured silicon surfaces by applying high-frequency 1D ultrasonic vibration cutting (UVC), which is expected to possess higher material remove rate. Thus, a detailed understanding of the machining mechanism is yet to be developed. In this study, a series of tests that involve cutting grooves on the silicon surface were first performed by applying UVC and using a single crystal diamond tool. The machined surface and chips were subsequently measured and analysed to evaluate the critical undeformed chip thickness, surface finish, and chip formation. The critical undeformed chip thickness of silicon was found to reach 1030 nm under a certain vibration amplitude. An array of micro grooves was generated at the plastic region with a surface roughness Ra as low as 1.11 nm. Moreover, the material removal and chip formation mechanisms were discussed with the assistance of developing a model used for predicting the length of the tool vibration mark. The results revealed that the micro topography of continuous chips exhibited discontinuous clusters of lines with diameters of dozens of nanometres which was only composed of polysilicon. The model was proved to be able to predict tool marks with extremely low error. Thus, the impact of tool marks on the surface finish can be reduced and even eliminated with help of the model.

show abstract

Rotary ultrasonic machining of carbon fiber–reinforced plastic composites: effects of ultrasonic frequency

Wang

Cong

et al. 2019

Int J Adv Manuf Technol

View full text Add to dashboard Cite

Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

Cited by 7 publications

References 18 publications

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves

Rotary ultrasonic machining of carbon fiber–reinforced plastic composites: effects of ultrasonic frequency

Contact Info

Product

Resources

About