Effects of Uniaxial Stress on Mo and Mo/Cu Bilayer Superconducting Transitions

Jaeckel, Felix T.; Kripps, Kari L.; McCammon, D.; Wulf, Dallas; Zhang, Shuo; Zhou, Yu

doi:10.1109/tasc.2016.2642579

Cited by 4 publications

(3 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Jaeckel et al [30] reported negligible effects of mechanical stress on the T c of their Mo film samples (grown in an e-beam system with ion assist). They applied an in situ tunable uniaxial pressure to the samples, and found that the change in T c is quite small (about 1 mK GPa −1 ), even when compared with pressure-induced T c variation in bulk Mo (at 5-8 mK GPa −1 ) [19].…”

Section: Effects On Superconductivity and Other Electrical Propertiesmentioning

confidence: 99%

Characterizing the stress and electrical properties of superconducting molybdenum films

Wang¹,

Liang²,

Ding³

et al. 2021

Supercond. Sci. Technol.

View full text Add to dashboard Cite

In the process of minimizing stress in sputtered Molybdenum (Mo) films for fabricating transition-edge sensor (TES) devices, we have investigated correlations between the stress and film deposition parameters. At a fixed sputtering power, the tensile stress of our film samples decreases toward both low and high ends of Ar pressure, suggestive of two physical mechanisms at work: an “atomic peening” effect at low Ar pressure and the development of voids at high Ar pressure. We have also carried out correlative studies of the stress and electrical properties (including superconducting critical temperature and residual resistivity) of the film samples, and found that the results are complex. We have made extensive comparisons with the published results, and attempted to explain the discrepancies in terms of film deposition techniques, sample preparation and treatment, and dynamical ranges of measurements. It is fairly clear that the microscopic properties, including porosity and disorder, of Mo films may have significant impact on the correlations.

show abstract

Section: Effects On Superconductivity and Other Electrical Propertiesmentioning

confidence: 99%

Characterizing the stress and electrical properties of superconducting molybdenum films

Wang¹,

Liang²,

Ding³

et al. 2021

Supercond. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…The electrical and thermal properties of Mo/W–Cu composites are closely related to the addition of alloying elements, [ 6 ] densification of green compacts, [ 18,19 ] thermal cycle, [ 20 ] and applied pressure in the case of hot pressing. [ 21 ] At present, the study in the densification of Mo/W–Cu composites is almost about the influence of a single factor, and there is no comprehensive summary of the densification process. In the experimental process, there are also considerable difficulties in fully characterizing the microstructure, atomic structure, and chemical properties of the interface, which can be described by creating molecular dynamics models.…”

Section: Introductionmentioning

confidence: 99%

Strengthening Mechanisms and Thermal Models of Chemically Incompatible Metals (Mo/W–Cu): A Review

et al. 2023

View full text Add to dashboard Cite

Molybdenum (Mo) and tungsten (W) are elements of the same family with similar properties, and both of them have high hardness, mechanical strength, and electrochemical corrosion properties, [1] which are widely used in the research and application of hightemperature and arc ablation-resistant materials. [2,3] Mo-Cu and W-Cu alloys are typical pseudoalloys. [4] There is almost no reaction between tungsten and copper, molybdenum and copper in the sintering process, and almost no intermetallic compounds are produced, which is due to the great differences in crystal structure and physical properties between tungsten and copper particles, molybdenum and copper particles. [5,6] W-Cu alloys and Mo-Cu alloys are widely used in microelectronics applications, aerospace technology, and military equipment because of their excellent electrical conductivity, excellent thermal conductivity, excellent arc resistance, flame retardant of fused joints, and other attractive properties. [1,[7][8][9] The addition of Cu and other high thermal conductivity (TC) metals can make it have a thermal expansion coefficient (CTE) close to silicon and high TC. [7][8][9][10][11][12][13] When the service temperature exceeds the melting point of Cu, Cu in the material can absorb a lot of heat through the transformation of physical states such as liquefaction and evaporation, and play a role of sweating and cooling. [9] As a result, Mo/W-Cu composites (Mo-Cu and W-Cu) have excellent high-temperature resistance and better ablation resistance than pure metal Mo/W. [14][15][16][17] Mo/W-Cu composites have excellent physical and mechanical properties, but their applications are severely limited by density and interface problems. Densification and interface strengthening can improve mechanical, thermal, and electrical properties of Mo/W-Cu composites. The electrical and thermal properties of Mo/W-Cu composites are closely related to the addition of alloying elements, [6] densification of green compacts, [18,19] thermal cycle, [20] and applied pressure in the case of hot pressing. [21] At present, the study in the densification of Mo/W-Cu composites is almost about the influence of a single factor, and there is no comprehensive summary of the densification process. In the experimental process, there are also considerable difficulties in fully characterizing the microstructure, atomic structure, and chemical properties of the interface, which can be described by creating molecular dynamics models. However, there are few researches on molecular dynamics simulation of Mo/W-Cu composite.Mo/W-Cu composites are an attractive radiator material due to their combinational properties of Mo/W and Cu. [22] However, Mo/W-Cu composites materials are widely distributed in

show abstract

“…The T c of pure Ti is from 360 to 500 mK [ 7 , 8 , 9 , 10 , 11 ] as the thicknesses changes. However, for a better Δ E , the T c should be ≈ 100 mK [ 12 , 13 , 14 , 15 , 16 , 17 ]. The tunable range of T c of a pure Ti film is limited.…”

Section: Introductionmentioning

confidence: 99%

Influence of the Interface Composition to the Superconductivity of Ti/PdAu Films

Rajteri

et al. 2020

Nanomaterials

Self Cite

View full text Add to dashboard Cite

In this work, the interface composition of the superconducting Ti/PdAu bilayer is tuned by an annealing process in N2 from 100 to 500 °C to control the superconducting transition temperature (Tc). This Ti-PdAu composition layer is characterized with a high-resolution transmission electron microscopy (HRTEM) and energy-dispersive spectrometer (EDS) to show the infiltration process. The surface topography, electrical, and cryogenic properties are also shown. The inter-infiltration of Ti and PdAu induced by the thermal treatments generates an intermixed layer at the interface of the bilayer film. Due to the enforced proximity effect by the annealing process, the Tc of Ti (55 nm)/PdAu (60 nm) bilayer thin films is tuned from an initial value of 243 to 111 mK which is a temperature that is suitable for the application as the function unit of a superconducting transition edge sensor.

show abstract

Effects of Uniaxial Stress on Mo and Mo/Cu Bilayer Superconducting Transitions

Cited by 4 publications

References 9 publications

Characterizing the stress and electrical properties of superconducting molybdenum films

Characterizing the stress and electrical properties of superconducting molybdenum films

Strengthening Mechanisms and Thermal Models of Chemically Incompatible Metals (Mo/W–Cu): A Review

Influence of the Interface Composition to the Superconductivity of Ti/PdAu Films

Contact Info

Product

Resources

About